Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition

Li, Yun; Xiong, Yingfei; Huí, Yang; Cao, Kun; Chen, Rong

doi:10.1557/jmr.2019.331

Cited by 57 publications

(38 citation statements)

References 149 publications

(156 reference statements)

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“…With the growing interest in flexible displays and automotive applications, thinner and better encapsulation is needed to facilitate the bending and folding flexibility, and to endure the extreme weather conditions that could be experienced in automotive applications. Besides CVD technology, another choice for making high‐quality barrier films is by plasma‐enhanced atomic layer deposition (PEALD), a layer‐by‐layer deposition process that consists of sequential alternating pulses of gaseous chemical precursors and RF power that induces radical reaction on the substrate surfaces 3 . Fig .…”

Section: Atomic Layer Deposition For Large Areamentioning

confidence: 99%

Realizing Thin‐Film Encapsulation's Benefits for Large‐Scale OLED Panels

Chen¹

2021

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Section: Atomic Layer Deposition For Large Areamentioning

confidence: 99%

Realizing Thin‐Film Encapsulation's Benefits for Large‐Scale OLED Panels

Chen¹

2021

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“…At present, device encapsulation is one of the key tasks to realize the industrialization because OLED is highly easy destroyed by moisture and oxygen. Thus, gas diffusion barriers with high performance are necessary to enhance the reliability and lifetime of OLEDs [3] .…”

Section: Introductionmentioning

confidence: 99%

“…In addition, barriers with multilayers comprised of alternating inorganic and organic films were widely used when high barrier performance was required. The incorporation of organic layers could prolong the diffusion pathways and reduce the thin film stress [3][4] .…”

Section: Introductionmentioning

confidence: 99%

P‐13.8: Fabrication of Al₂O₃/alucone Nanolaminates Using ALD/MLD and its Application to OLED Encapsulation

Chen

Weng

Zhang

et al. 2021

Symp Digest of Tech Papers

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Thin film encapsulation (TFE) is vital for flexible organic light‐emitting diodes (OLEDs). In this work, the Al2O3/alucone nanolaminates grown by atomic layer deposition (ALD) and molecular layer deposition (MLD) were investigated as TFE for OLEDs. It was found that alucone film with the suitable thickness could better flatten Al2O3 film by filling the defects. The nanolaminates of 15/2.5 nm Al2O3/ alucone had high density to minimize the pass of water vapor, and the barrier properties were improved with the increasing number of dyads. The water vapor transmission rate (WVTR) could reached 1.44×10−4 g/m2/day with 5.5 dyads nanolaminates in a control environment of 25 °C, 60% RH. The lifetime (L/L0=0.5) of a green OLED could reached more than 380h using 5dyads nanolaminates as encapsulation layer. The result indicated a promising encapsulation method to prolong the lifetime of OLED.

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“…In addition, the self-limiting nature of ALD produces extremely smooth, continuous, and pinhole-free films, because no un-coated surface sites are left behind during film growth. This is extremely important for example in thin-film encapsulation (TFE) to improve diffusion barrier properties [32]. Single-element materials and alloys/ compounds as well as alternating monolayer structures can be fabricated with extreme precision, where optimization of these layers requires engineering thicknesses and structures.…”

Section: Introductionmentioning

confidence: 99%

Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies

et al. 2021

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In this study, we demonstrate how metal-oxide thin-film conformal coatings grown by atomic layer deposition (ALD) can be exploited as an effective approach to mitigate tin whisker growth on printed circuit boards. First, we study the effect of different ALD coatings and process parameters on Sn–Cu-electroplated test coupons, by combining optical imaging and scanning electron microscopy and evaluating whisker distribution on the surface. On these samples, we found that one important parameter in mitigating whisker growth is the time interval between electroplating and the ALD coating process (pre-coat time), which should be kept of the order of few days (2, based on our results). Atomic layer-deposited coatings were also found to be effective toward whisker formation in different storage conditions. Furthermore, we show that ALD coating is also effective in limiting the need for outgassing of electronic assemblies (PCBAs), which is an additional stringent requirement for applications in space industry. Our experimental results thus demonstrated that atomic layer deposition is a suitable technique for aerospace applications, both in terms of degassing and whisker mitigation.

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Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition

Abstract: Abstract

Cited by 57 publications

References 149 publications

Realizing Thin‐Film Encapsulation's Benefits for Large‐Scale OLED Panels

Realizing Thin‐Film Encapsulation's Benefits for Large‐Scale OLED Panels

P‐13.8: Fabrication of Al₂O₃/alucone Nanolaminates Using ALD/MLD and its Application to OLED Encapsulation

Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies

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Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition

Abstract: Abstract

Cited by 57 publications

References 149 publications

Realizing Thin‐Film Encapsulation's Benefits for Large‐Scale OLED Panels

Realizing Thin‐Film Encapsulation's Benefits for Large‐Scale OLED Panels

P‐13.8: Fabrication of Al2O3/alucone Nanolaminates Using ALD/MLD and its Application to OLED Encapsulation

Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies

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Product

Resources

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P‐13.8: Fabrication of Al₂O₃/alucone Nanolaminates Using ALD/MLD and its Application to OLED Encapsulation