2011
DOI: 10.1002/adma.201102526
|View full text |Cite
|
Sign up to set email alerts
|

Transfer‐Free Growth of Few‐Layer Graphene by Self‐Assembled Monolayers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

2
52
0
4

Year Published

2012
2012
2017
2017

Publication Types

Select...
9
1

Relationship

0
10

Authors

Journals

citations
Cited by 83 publications
(58 citation statements)
references
References 24 publications
2
52
0
4
Order By: Relevance
“…11,12 We emphasize that the graphene grown by annealing at 600 °C shows significantly better uniformity than other reports of growth from solid carbon across the literature, while the graphitic quality is comparable to the best reported values, even when notably higher growth temperatures (≥900 °C) were used. 68 …”
mentioning
confidence: 99%
“…11,12 We emphasize that the graphene grown by annealing at 600 °C shows significantly better uniformity than other reports of growth from solid carbon across the literature, while the graphitic quality is comparable to the best reported values, even when notably higher growth temperatures (≥900 °C) were used. 68 …”
mentioning
confidence: 99%
“…As there is no significant solubility of carbon in copper, the film formation is expected to be very inhomogeneous. Alternatively Cu is used as catalytic material to convert a self-assembled monolayer as carbon source at the Cu/SiO 2 substrate to graphene [31]. …”
Section: Reviewmentioning
confidence: 99%
“…Although high-quality graphene is synthesized by useful methods, the post-contaminations during the transfer process of a synthesized graphene sheet to a substrate results in deformation of the pristine properties, which can limit the potential use of graphene. The post-contamination (e.g., metal ion impurities and polymer residuals) in the transfer process of a CVD graphene sheet can produce wrinkles and cracks [9,10]. Thus, the alternative direct synthesis of graphene on a dielectric substrate (e.g., silicon dioxide, SiO 2 ) was introduced to avoid post-contamination [4,11].…”
Section: Introductionmentioning
confidence: 99%