“…The next major improvement came for the addition of "n enhancement" layer with the aim of further increasing the electron injection at the cathode side of the drift region. Some of the most effective designs in achieving this include the IEGT (Injection Enhanced Gate Transistor) [1,2], the CSTBT (Carrier Store Trench Bipolar Transistor) [3], the Trench EST (Emitter Switched Thyristor) [4,5], the HiGT (High Conductivity IGBT) [6,7] and the DMOS SPT+ IGBT (Soft Punch Through plus) [8]. The higher the doping concentration of the "n enhancement", the more significant the improvement in the on-state characteristics is.…”