8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings
DOI: 10.1109/ispsd.1996.509485
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Undamped inductive switching of integrated quasi-vertical DMOSFETs

Abstract: This investigation explores the unclamped inductive switching (UIS) performance and failure mechanisms of 6OV quasi-vertical N-channel DMOSFETs through measurement and numerical device simulation. The non-uniform current distributions that arise inside the DMOS during UIS are analyzed and the effects of local self-heating are investigated.

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Cited by 7 publications
(2 citation statements)
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“…In CMOS technology, the main usage of the snapback characteristic is to sink high current for electrostatic discharge (ESD) event or unclamp inductance switching (UIS) [2]. In order to pass the required ESD level, the ESD protection device is usually a large dimension device.…”
Section: Introductionmentioning
confidence: 99%
“…In CMOS technology, the main usage of the snapback characteristic is to sink high current for electrostatic discharge (ESD) event or unclamp inductance switching (UIS) [2]. In order to pass the required ESD level, the ESD protection device is usually a large dimension device.…”
Section: Introductionmentioning
confidence: 99%
“…The first one is the unclamped inductive switching [1] caused by turning off the driver rapidly. The second one is the diode recovery stress [2] caused by the rapid commutation of the current of the parasitic diode in the output transistor from forward to reverse bias.…”
Section: Introductionmentioning
confidence: 99%