“…Three-dimensional (3D) bicontinuous nanoporous structures fabricated by dealloying 25 , the selective removal of the less stable component(s) from an alloy, are very attractive owing to their large specific surface area with ample surface defects, high electric conductivity, and rapid mass transport pathways 19 , 26 . Several intermetallic compounds have been fabricated or integrated into 3D porous structures by the chemical etching of heterogeneous precursors (such as Mg 2 Cu 27 , PtSi 28 , (Pt 1-x M x ) 3 Al (M = Ni, Co, Fe) 29 – 31 , SbSn 32 , and Pd 3 Bi 24 ) or by segregation as nanoparticulate phases anchored on 3D nanoporous metal frameworks during dealloying (such as Cu 3 Sn/Cu 33 , Co 3 Mo/Cu 10 , Al 7 Cu 4 Ni/Cu 34 , and Nb 5 Si 3 /NbTi 35 ). However, these porous intermetallic materials exhibit low flexibility in microstructural optimization, high electric resistance due to copious grain boundaries and interfaces, and poor mechanical stability.…”