Use of gas as low-k interlayer dielectric in LSI's: Demonstration of feasibility

Anand, M.B.; Yamada, Masaki; Shibata, H.

doi:10.1109/16.641367

Cited by 32 publications

(18 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This includes fabrication of air-gaps in electrical interconnects, MEMS, microfluidic devices, and micro-reactors. The formation of air-gaps is important in electrical interconnects because it lowers the effective dielectric constant of the matrix [1]- [5]. The fabrication of buried air-channels is useful for the creation of vias in multi-level wiring boards, micro-display boards with high resolution, and ink-jet printer heads.…”

Section: Introductionmentioning

confidence: 99%

Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates

Jayachandran

Reed

Zhen

et al. 2003

J. Microelectromech. Syst.

View full text Add to dashboard Cite

This research involves the fabrication of encapsulated air-channels via acid-catalyzed degradation of photosensitive polycarbonates (PCs). There is a need for lower-temperature, degradable polymeric materials to fabricate buried air-channels for microelectromechanical systems (MEMS), microfluidic devices, and micro-reactors. Some polycarbonates undergo thermolytic degradation in the temperature range of 200 to 350 C. These polycarbonates are also known to undergo acid-catalyzed decomposition in the presence of catalytic amounts of acid. A small percentage of an acid in the polycarbonate formulation can greatly reduce the onset of decomposition temperature to the 100 to 180 C temperature range. The photoacid and thermalacid induced degradation behavior of PCs and its use as a sacrificial material for the formation of air-gaps have been studied in this work. The decomposition of several polycarbonates with the aid of in situ generated photo-acid has been demonstrated and applied to the fabrication of micro air-channels. Based on FT-IR, mass spectrometry, and thermogravimetric analysis (TGA), a degradation mechanism was proposed.[849]

show abstract

Section: Introductionmentioning

confidence: 99%

Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates

Jayachandran

Reed

Zhen

et al. 2003

J. Microelectromech. Syst.

View full text Add to dashboard Cite

show abstract

“…In addition, some recent studies [18][19][20][21] proposed methods for utilizing air as ILDs. These novel approaches, however, fall short of being satisfactory in terms of the semiconductor industry standards.…”

Section: Introductionmentioning

confidence: 99%

Feasibility of using vanadium to form damascene structures with an air gap

Nam¹,

Shin²,

Cho³

et al. 2007

Current Applied Physics

View full text Add to dashboard Cite

“…2c and d. In Fig. 2f, all sacrificial layers are removed by an etching process such as described in [2] or [3]. A top nonconformal dielectric is deposited to seal the arch-shaped air pocket.…”

mentioning

confidence: 99%

“…The air gaps of non-uniform size and shape were made by inter-metal dielectric (IMD) deposition. The NURA process [2] uses O 2 gas diffused through a thin bridge layer (SiO 2 ) to react with the underlying carbon layer at 4508C. Chen reported an air gap interconnect scheme using the copper dual damascene process.…”

mentioning

confidence: 99%

Vacuum-sheath interconnect structure for dense memory

Park

2009

Electron. Lett.

View full text Add to dashboard Cite

Use of gas as low-k interlayer dielectric in LSI's: Demonstration of feasibility

Cited by 32 publications

References 7 publications

Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates

Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates

Feasibility of using vanadium to form damascene structures with an air gap

Vacuum-sheath interconnect structure for dense memory

Contact Info

Product

Resources

About