2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers 2014
DOI: 10.1109/vlsit.2014.6894366
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Verification on the extreme scalability of STT-MRAM without loss of thermal stability below 15 nm MTJ cell

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Cited by 20 publications
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“…At sub-40 nm dimensions, process damage can play a dramatic role on MTJ behavior, as was shown by Samsung [102] with MTJ dimensions between 15 and 50 nm. An improved process with reduced side-wall damage allowed the improvement of ∆ to 40 at 15 nm diameter.…”
mentioning
confidence: 77%
“…At sub-40 nm dimensions, process damage can play a dramatic role on MTJ behavior, as was shown by Samsung [102] with MTJ dimensions between 15 and 50 nm. An improved process with reduced side-wall damage allowed the improvement of ∆ to 40 at 15 nm diameter.…”
mentioning
confidence: 77%
“…The current trend of STT-MRAM cell design is to switch from the inplane MTJ [ Figure 1(a)] to the perpendicular MTJ [ Figure 1(b)] to allow better scalability, longer retention, and lower Jc [9], [10]. The in-plane MTJ's scalability is limited by the aspect ratio (length/width in the lateral dimension) of the cell, as a sufficient shape anisotropy is required for thermal stability, while [11], [12].…”
Section: Stt-mram Cellsmentioning
confidence: 99%
“…This type of PMA is categorized as bulk PMA in contrast to interfacial PMA. In 2010, Ikeda et al found the interfacial PMA (i-PMA) in CoFeB/MgO-based MTJs [79]. It is very meaningful for real applications that they demonstrated a large TMR and a large PMA with a relatively low STT switching current, even though PMA has been observed at transition metal/ oxide interfaces before [80].…”
Section: Memristor Devicesmentioning
confidence: 99%