Wafer Level Integration of a 24 GHz Differential SiGe-MMIC Oscillator with a Patch Antenna using BCB as a Dielectric Layer

Abstract

Abstract-This paper describes the wafer level integration of a differential 24 GHz SiGe-MMIC oscillator including a buffer amplifier with a differentially driven patch antenna. The patch antenna is realized on 30 µm BCB (Benzo Cyclo Butene) used as a dielectric layer. The radiated power of the patch antenna driven by the oscillator is calculated based on measurements and the result is discussed.

Comparison of Three Methods for the Measurement of the Differential Impedance of a Balanced Device [Measurements Corner]

“…Most reported results were actually the characteristics of a balun-antenna combination [7][8][9][10]. Figure 9 compares the measured differential impedances of the narrowband balanced microstrip patch antenna from 2.0 GHz to 3.0 GHz obtained from the three methods.…”

“…The differential impedance, an important balanced-device parameter, is required in the design of the matching network between two balanced circuits in a radio system [7][8][9]. The differential input impedance, d Z , of a balanced device is given by 11 21…”

Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations

“…A chip-size folded shorted-patch antenna fabricated using WLP techniques was designed, fabricated, and characterized. This folded antenna has smaller dimensions (4 mm × 4 mm × 1 mm) when compared to the previous works [10,11]. It operates at 5.05 GHz, a frequency inside the 5-6 GHz ISM band, and with a bandwidth of ∼200 MHz, which is sufficient for applications in wireless sensor networks.…”

Wireless microsystems for biomedical applications

“…The folded shorted-patch antenna in the Figure 3(a) was fabricated by Mendes [12] and it exploits the third dimension for fabricating small antennas with relatively good radiation characteristics. As illustrated in the Figure 3(b), specific microfabrication techniques were employed on its fabrication: e.g., sputtering of top and bottom layers of thin-films made of aluminium (Al) [13], patterning of the Al top layer [14], adhesive bonding (using the BCB -Benzo Cyclo Butene -as adhesive material [15]), seesaw cut dicing [16], vias formation by laser ablation, and singulation by dicing [17]. [12]: Schematics showing (a) the concept, and (b) the fabrication sequence using microfabrication techniques (by laser ablated vias, sputtering, and so on).…”