2021
DOI: 10.1016/j.matchar.2021.111304
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Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems

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Cited by 10 publications
(7 citation statements)
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“…First, discussing any observed wetting behavior, which is independent of droplet size (limit case of large sizes), it is striking that the observed wetting angles of eutectic Cu/Sn 0.6 Pb 0.4 are much smaller than those for the Cu/Sn system. However, this is expected regarding the much lower equilibrium contact angles of lead-rich solders on Cu in comparison to pure Sn . It is primarily caused by the lower surface energy of Pb, which furthermore preferentially segregates to the surface .…”
Section: Resultsmentioning
confidence: 99%
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“…First, discussing any observed wetting behavior, which is independent of droplet size (limit case of large sizes), it is striking that the observed wetting angles of eutectic Cu/Sn 0.6 Pb 0.4 are much smaller than those for the Cu/Sn system. However, this is expected regarding the much lower equilibrium contact angles of lead-rich solders on Cu in comparison to pure Sn . It is primarily caused by the lower surface energy of Pb, which furthermore preferentially segregates to the surface .…”
Section: Resultsmentioning
confidence: 99%
“…However, this is expected regarding the much lower equilibrium contact angles of lead-rich solders on Cu in comparison to pure Sn. 24 It is primarily caused by the lower surface energy of Pb, which furthermore preferentially segregates to the surface. 24 There are two further variables that may influence the size-independent CA limit: (i) the reflow temperature and (ii) the surface roughness, which causes a shift in the wetting equilibria according to Wenzel's model expressed by a variation of Wenzel's roughness factor.…”
Section: Size-independent Wetting Regimementioning
confidence: 99%
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“…Currently, many lead-free solders have been studied in various fields as alternatives to Sn-Pb solders, such as Sn-Ag-Cu [ 1 , 2 ], Sn-Bi [ 3 , 4 ], Sn-Zn [ 5 ], Sn-Cu [ 6 ], Sn-In [ 7 ], and so on. Among them, the Sn-Bi series has been extensively studied by researchers for its lower cost and good wettability [ 8 , 9 , 10 ]. Sn-58Bi eutectic alloys have been widely used in industry, but the high content of Bi leads to high brittleness [ 11 ].…”
Section: Introductionmentioning
confidence: 99%
“…Sn-Pb solder is widely used in electronic packaging due to its low cost, low melting temperature and excellent wettability [1,2]. However, Pb has gradually received widespread concern for its toxicity, and thus the European Union issued directives such as Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) to ban the use of Pb in electronic products [3].…”
Section: Introductionmentioning
confidence: 99%