2006
DOI: 10.1143/jjap.45.l516
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Writing Current Reduction in Phase Change Memory Device with U-shaped Heater (PCM-U)

Abstract: For the writing current reduction, we firstly proposed and successfully manufactured phase change memory device with U-shaped heater (PCM-U) device, in which TiN heater surrounds Ge2Sb2Te5 (GST). The experimental results clearly indicate that PCM-U has noticeably shorter SET operation time and 50% smaller RESET current, compared with the conventional. We suggest that the improved properties of PCM-U are due to the overlap of programmable volume.

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Cited by 16 publications
(8 citation statements)
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“…So far, Ge 2 Sb 2 Te 5 material has been mainly employed for the fabrication of C-RAM due to the good electrical and thermal performance. [5][6][7][8] Great efforts have also been made on researches of new-composition phase change materials for C-RAM application in the recent years. Various kinds of materials were studied, such as Sb-Te, 9) Ge 1 Se 1 Te 2 , 10) Sb-Se, 11) In-Se, 12) Si-Sb-Te, 13) etc.…”
mentioning
confidence: 99%
“…So far, Ge 2 Sb 2 Te 5 material has been mainly employed for the fabrication of C-RAM due to the good electrical and thermal performance. [5][6][7][8] Great efforts have also been made on researches of new-composition phase change materials for C-RAM application in the recent years. Various kinds of materials were studied, such as Sb-Te, 9) Ge 1 Se 1 Te 2 , 10) Sb-Se, 11) In-Se, 12) Si-Sb-Te, 13) etc.…”
mentioning
confidence: 99%
“…66,67 If the chalcogenide-insulator nanocomposite structure is employed to obtain a programmable medium (Figure 7d), the phase transition induced by resistive Joule heating can be promoted because of the concentration of thermal heat with a reduced volume of the programmable medium. 68 Therefore, a lower programming current is required, which enables the phase change in memory devices with low power consumption. 69,70 The obtained results verify that the nanocomposite film can aid in improving the performance of several devices; nevertheless, its sophisticated fabrication technique requires further analysis and development.…”
Section: Fabrication Ofmentioning
confidence: 99%
“…In addition the relatively long crystallization time of GST (∼ hundreds nanoseconds) limits the ultimate operation speed of the PCRAM device [7]. A confined cell structure where the phase-change material is formed inside a contact via is expected to be essential for the next-generation PCRAM device because it requires lower switching power [8]. This structure however requires more complex deposition of the active chalcogenide into a cell pore.…”
Section: Introductionmentioning
confidence: 99%