nano-computed-tomography (nano-CT). They have emerged in many synchrotrons worldwide [1][2][3][4][5][6] and have been widely used in energy science where typical spatial resolutions of 30-60 nm and respective field of view (FOV) of about 40-70 μm are ideal for the ex situ or in situ characterization of different type of lithium-ion batteries. [7][8][9][10][11][12] However, they can be also utilized to characterize any type of materials like alloys, [13,14] rocks, [15] single minerals in solution, [16,17] polymers, [18] liquids, [19] biological tissues, [20] etc. While 19 nm spatial resolution has been reported in 2D on gold test patterns with long exposure, [21,22] existing TXMs operating with high brightness synchrotron sources currently provide a maximum resolution of 30 nm. [23] Projection microscopy, another full-field nano-CT technique, has the potential of achieving sub-20 nm spatial resolution. However, the best 3D resolution reported so far is 55 nm. [24] The constant and rapid development of manufactured nanomaterials and the societal and economic stakes associated with them are important drivers for improving the resolving power of X-ray microscopes.In the last decade, transmission X-ray microscopes (TXMs) have come into operation in most of the synchrotrons worldwide. They have proven to be outstanding tools for non-invasive ex and in situ 3D characterization of materials at the nanoscale across varying range of scientific applications. However, their spatial resolution has not improved in many years, while newly developed functional materials and microdevices with enhanced performances exhibit nanostructures always finer. Here, optomechanical breakthroughs leading to fast 3D tomographic acquisitions (85 min) with sub-10 nm spatial resolution, narrowing the gap between X-ray and electron microscopy, are reported. These new achievements are first validated with 3D characterizations of nanolithography objects corresponding to ultrahigh-aspect-ratio hard X-ray zone plates. Then, this powerful technique is used to investigate the morphology and conformality of nanometer-thick film electrodes synthesized by atomic layer deposition and magnetron sputtering deposition methods on 3D silicon scaffolds for electrochemical energy storage applications.