No abstract

In the current study, a network-based resistor model has been developed for thermal analysis of a complex optoelectronic package called SFP (Small Form-factor Pluggable Device). This is done using the DELPHI (DEvelopment of Libraries of PHysical models for an Integrated design) Methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction, and typically has four heat generating sources. The detailed model for the SFP is constructed and validated using a natural convection experiment. The validated detailed model is used for generating the Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM). Codes for solving the network topology and interfacing with the optimization subroutine were written using Matlab 7. The resulting CTM is extensively validated with multiple boundary condition sets. The CTM for the SFP shows maximum relative of errors less than 10% for the junction temperature on all of its active components and less than 20% for the heat flows through its sides for extreme set of boundary conditions.

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An extensive study was performed aimed at developing compact thermal models of a variety of electronic packages used in conduction cooled scenarios. A non-redundant set of boundary conditions suitable for the generation of compact thermal models for packages cooled by conduction to the board was developed by formal mathematical principles. A Design of Experiments method was used to reduce this set to four conditions allowing the creation of CTM's that were independent of board and underfill characteristics. The accuracy of generating CTM's by applying external resistances representative of underfill and board resistances was critically examined. The technique was found to be convenient for optimizing the model parameters on both junction temperatures and heat flows through the prime lumped areas. Detailed thermal models of about thirty parts, representing thirteen different package types, were created from physical part data extracted from X-ray, SEM and high-power microscopy images. Using optimization techniques allowing constrained non-linear global optimization, compact models of different network topologies were generated for all the packages. To optimize the thermal networks, a Genetic Algorithm-based commercial code was employed in a standard spreadsheet environment. It was found that for most of the packages only network topologies that included a floating node provided satisfactory accuracy for both the junction temperatures and heat flows through the prime lumped areas. kundcriill RJ-L RJ-P.B -'P,E

In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP, is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%.