No abstract

No abstract

No abstract

In this paper, we present an integrated approach for achieving improved yield ramp and enhanced manufacturing margins for deep sub-micron process technologies.This methodology highlights the combination of design IP for process technologV characterization, tailored data reduction and analysis of the design components for data characterization, and fault modeling and extraction for root cause failure delermination. This approach enables semiconductor companies to characterize yield loss and improve manufacturing process.

No abstract