In this paper a novel manufacturing technique is investigated with the aim of integrating magnetic components (e.g. inductors and transformer) on power module substrates together with the switching devices, to minimize overall dimensions and improve thermal management. The proposed approach consists of bonding copper U-shapes, representative of individual turn of the windings, onto the substrate. This offers an enhanced thermal exchange between the inductors and the cooling system and hence an increase in the current density.

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Gelcasting is a well established process for ceramics manufacturing which recently has been proved to be successful for soft ferrites as well. This approach is particularly interesting for power electronics application in which the magnetic components (e.g. transformers and inductors) are three dimensionally integrated on the power module substrate. This paper proposes a gelcasting process adapted to make it more effective for 3D heterogeneous integration. The main novelties in this direction consist of low solid load (65wt%) and gelation without catalyst to improve casting and de-airing steps. The magnetic properties of gelcast samples are compared with commercial materials and correlated with the microstructure.