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Abstract-An assembly exercise was proposed to replace the vertical MOSFET by lateral IGBTs (LIGBT) for LED driver systems which can provide significant advantages in terms of size reduction (LIGBTs are ten times smaller than vertical MOSFETs) and lower component count. A 6 circle, 5V gate, 800 V LIGBT device with dimension of 818μm x 672μm with deposited solder balls that has a radius of around 75μm was selected in this assembly exercise. The driver system uses chip on board (COB) technique to create a compact driver system which can fit into a GU10 bulb housing. The challenging aspect of the LIGBT package in high voltage application is underfill dielectric breakdown and solder fatigue failure. In order to predict the extreme electric field values of the underfill, an electrostatic finite element analysis was undertaken on the LIGBT package structure for various underfill permittivity values. From the electro static finite element analysis, the maximum electric field in the underfill was estimated as 38 V/μm. Five commercial underfills were selected for investigating the trade-off in materials properties that mitigate underfill electrical breakdown and solder joint fatigue failure. These selected underfills have dielectric breakdown higher than the predicted value from electrostatic analysis. The thermomechanical finite element analysis were undertaken for solder bump reliability for all the underfill materials. The underfill which can enhance the solder reliability was chosen as prime candidate.

Polyethylene terephthalate (PET) is a widely used polymer in the production of bottles by injection stretch blow moulding (ISBM). In this work, we present a characterization method to identify material properties directly from a preform, considering temperature and stress-relaxation effects related to its viscoelastic response. A customized oven and gripping system were designed to perform uniaxial tests in a proper temperature range on tubular specimens obtained from preforms. A visco-hyperelastic model is then proposed: a Marlow-type strain energy function coupled with a Prony series and William-Landel-Ferry equation to include time and temperature dependency. Finally, a case study of ISBM process is implemented in a finite element code considering this constitutive model. Strain maps and predicted thickness of the bottle wall were evaluated as process quality indicators. Simulation results showed good agreement with measurements on the real processed bottle, confirming the usefulness of the approach for product or process parameters optimization.

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