Republic of China
SYNOPSISIncompatible polymer blends between polyamide-6 (PA6) and poly(pheny1ene oxide) (PPO) have been compatibilized in situ by the styrene-glycidyl methacrylate (SG) reactive copolymers. The epoxy functional groups in SG copolymers can react with the PA6 amine and carboxylic endgroups at interface to form various SG-g-PA6 copolymers. These in situformed grafted copolymers tend to anchor along interface to function as compatibilizer of the blends. The styrene and the SG segments of the grafted copolymers are miscible (or near miscible) with PPO; whereas the PA6 segments are structurally identical with PA6 phase. The compatibilized blend, depending on quantity of the compatibilizer addition and the glycidyl methacrylate (GMA) content in the SG copolymer, results in smaller phase domain, higher viscosity, and improved mechanical properties. About 5% GMA is the optimum content in SG copolymer that produces the best compatibilization of the blends. This study demonstrates that SG reactive copolymers can be used effectively in compatibilizing polymer blends of PA6 and PPO. 0 1996 John Wiley & Sons, Inc.
This work investigates the thermal stability and physical and barrier properties of two species of plasma-enhanced chemical vapor deposited (PECVD) -SiC:H silicon carbide films (with k-values less than 5) deposited using trimethylsilane, (CH 3 ) 3 SiH (3MS) and tetramethylsilane, (CH 3 ) 4 Si (4MS) organosilicate gases. It is found that the 4MS -SiC:H film contains a higher content of carbon and has a lower dielectric constant. Both of the 3MS and 4MS -SiC:H films are thermally stable at temperatures up to 500 C. However, degraded barrier property and moisture resistance were observed for the 4MS -SiC:H film; this is attributed to the porosity enrichment caused by the film's high carbon content. The 3MS -SiC:H film, which exhibits a superior Cu-barrier property, is a potential candidate for replacing the higher dielectric constant Si 3 N 4 film as a Cucap barrier and etching stop layer in the Cu damascene structure.
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