CdSe thin film transistor (TFT) structures which have been ion implanted with 50 keV 52Cr, 50 keV 27Al, or 15 keV 11B have a very steeply rising conductivity above some threshold dose and exhibit modulated transistor characteristics over certain ranges of implant dose, even though there is no thermal annealing during or after ion implantation. These results are interpreted using a model based on grain boundary trapping theory. The dependence of leakage current on implant dose, and of drain current (at a fixed dose) on gate voltage are described very well by this model, when the drain voltage is very small. Using this simple model, the important parameters of the polycrystalline CdSe film, namely the trap density per unit area in the grain boundary, the donor density, grain size, and electron mobility can be deduced. The effect of thermal annealing on implanted and unimplanted CdSe TFT’s has also been studied and the model appears to give a general description of the conductivity behavior in polycrystalline semiconductor TFT’s. This is illustrated by applying the model to devices fabricated by other groups from polycrystalline CdSe, poly-Si and laser-annealed poly-Si semiconductor layers.

Oxygen microwave (mW) plasmas have been used to strip AZ 1350 J photoresist on glass substrates and to decapsulate hybrid resistor networks and Si IC packages. It has been found that the use of microwaves as the generating field provides an abundance of long‐lived atomic oxygen such that processing can be carried out in the afterflow of the discharge. In this downstream system, photoresist and organically based epoxy encapsulants were removed at rates of approximately 6.0 μm/min. In addition, optical emission spectroscopy, from the O2 plasma and the chemiluminescence in the processing zone, has been used to characterize the system.

We directly image an InP p–n junction depletion region under both forward and reverse bias using scanning voltage microscopy (SVM), a scanning probe microscopy (SPM) technique. The SVM results are compared to those obtained with scanning spreading resistance microscopy (SSRM) measurements under zero bias on the same sample. The SVM and SSRM data are shown to agree with the results of semiclassical calculations. The physical basis of the SVM measurement process is also discussed, and we show that the measured voltage is determined by the changes in the electrostatic potential and the carrier concentration at the SVM tip with and without the applied bias.

Al and Ti planar magnetron targets have been sputtered in Ar/N2 mixtures to deposit AlN and TiN films on unheated substrates; rf and dc discharges were used for the AlN and TiN deposition, respectively. The N2 flow was always sufficient to produce a nitrided target layer and x-ray diffraction showed single-phase films of AlN and TiN1.2. In N2 discharges, the AlN film stress varied from −19 GPa (compressive) to +2.5 GPa (tensile) as the pressure increased from 0.2 to 5 Pa. Intrinsic tensile stress in reactively sputtered compound films has not previously been reported. A similar change was observed in the stress of TiN films. Zero-stress AlN and TiN films were obtained at ∼1 Pa for the sputtering conditions used. The rapid decrease in compressive stress with increasing pressure is associated with a rapid decrease in both target voltage (for constant applied power) and deposition rate. Calorimetry measurements of the power flux at the substrates show an increase with pressure. With increasing Ar content, at a constant pressure, the compressive stress decreases although the target voltage and deposition rate increase; the substrate power flux decreases. The surface coverage of N on the targets increases with increasing N2 pressure because the N+2 flux increases. The compressive stress is probably due to bombardment of the film by neutral N atoms reflected with high energy from the targets. The decrease in deposition rates and increase in substrate power density may result from increased sputtering rates of N atoms from the target with a consequent decrease in metal atom sputtering.

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