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Nowadays multilayer substrate with excellent characteristics have been required increasingly for miniaturizing, and achieving high level functions. The authors have attempted to produce a high density functional module including new polymeric substrate technology. The module consists of three parts: the multilayer substrate, the block including electrical parts and the thin film resistor sheet. A polycarbonate resin film was selected as the substrate. A conductive paste made from silver powder and thermoplastic resin binder was printed on the polycarbonate resin film. Then these films are piled up and laminated by thermal press. The parts are placed and molded into a shape of block with W curing resin. The resistor layer is formed by sputtering a thin NiCr film on the polyimide resin coated stainless steel plate. The parts block and the resistor sheet are aligned to the substrate corresponding to their electrodes, then adhered each other with adhesive resin. In this paper, we discuss the actual processes of the manufacturing of the module according to the new mounting method.

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