RF-MEMS technology is emerging as a key enabling solution to address demanding requirements that upcoming 5G standards pose upon passive devices and networks. In this work, we demonstrate experimentally-to the best of our knowledge, for the first time-, RF-MEMS 2-state basic attenuator modules, from nearly-DC up to 110 GHz. Physical samples are realized in the CMM-FBK RF-MEMS technology, and design variations are tested. Resistive loads are placed in series or shunt configuration on the RF line, and the attenuation is ON/OFF switched by electrostatically driven MEMS micro-relays. Tested devices show attenuation levels (S21) from-5 dB to-10 dB, depending on the resistive load, with flatness of 2-3 dB from 10 MHz to 50 GHz and of around 2 dB from 60 GHz up to 110 GHz. When OFF, the attenuator modules introduce loss (S21) better than-1 dB up to 50 GHz and better than-6 dB up to 110 GHz
Aim:Processing of the samples in molecular diagnostics is complex and labor-intensive. An integrated and automated platform for sample preparation and nucleic acid-based detection can significantly relieve this burden for the users.Results:We present a prototype of a versatile and integrated platform for the detection of pathogens in various liquid media. We describe a proof-of-concept for the integrated isolation of bacteria, cell lysis with optional DNA extraction, DNA amplification and detection in two different reactions, loop-mediated isothermal amplification and PCR, on a single microfluidic platform.Conclusion:The platform enables the transition from large sample volume to microfluidic format. The design and open interface enable its versatile application for various nucleic acid-based assays, from simple to complex setups.
Packaging and interconnection are driving forces behind the miniaturization of electronics. Since miniaturization means less use of resources this trend seems inherently environmentally benign. Adverse effects may overlay this simple truth. The investments for new production facilities rise, the complexity and closeness of non-separable compounds in electronic products increase and the amount and applications of electronic goods multiply. The goal must be to influence new technology developments as early as possible to ensure that the balance of the listed effects remains positive for the environment. As a first step in this direction a simple comparison of different interconnection options is made which is based on the material content of the different printed circuit board assemblies
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