Igor Jekauc scite author profile

Nicholas.CIements@,infineon.com P a u l . J o w e t t @ l &hen.F ereusonlhinfineon. c o q pan.Manson@infineon.co m Cort.Dem-' MarkRichmo AbstractSignficanrfinancial benefifs are realized by reducing the wafer edge erclurion to gain additional producfive chips as well as enhance the yield of fhe former edge-mosr region of the wafer. Challenges are discussed and cos:. ejfpcrive solutions provided for major unir process and inlegration issues such as plasma-efch induced blocked/dis:ortedpa:tern, image displacement, inrerlayer misalignment, lifhography edge coating and pafterning, pafterndensifydependenf CMP and Etch nonuniformify, scribe readability. and shared-driver shorfs.

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Aberration measurement and matching: a correlation of measurement techniques and dedication scheme implications

Roberts

Jekauc

2004

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Mask error factor: critical dimension variation across different tools, features, and exposure conditions

Jekauc

Roberts

Hampe

2001

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Igor Jekauc

Necessity of chemical edge bead removal in modern-day lithographic processing

Necessary nonzero lithography overlay correctables for improved device performance for 110nm generation and lower geometries

"Extreme edge engineering" - 2 mm edge exclusion challenges and cost-effective solutions for yield enhancement in high volume manufacturing for 200 and 300 mm wafer fabs

Aberration measurement and matching: a correlation of measurement techniques and dedication scheme implications

Mask error factor: critical dimension variation across different tools, features, and exposure conditions

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