She received her Ph. D. in Mechanical Engineering from the University of Maryland at Baltimore County (UMBC), Baltimore, Maryland, in May 2003. Her research interests include mechanical applications in microelectronics, biomechanics, system dynamics, and system optimizations, etc.

Board-level physical test performance of CSP/BGA packages need in depth characterization of loading parameters and material behavioral properties. In recent years, many calibration methods were adopted by the researchers and industries to improvise solder joint performances of packages. Effective and uniform board response is one of the critical challenges in developing test board to qualify package components for solder joint reliability qualification. In this paper, an improvised board type alternative to standard Joint Electron Device Engineering Council (JEDEC) board is developed for uniform stress/strain response. An axis symmetrical board is chosen in comparison to the current JEDEC board. The effectiveness of the two boards are compared with each other under extreme banding under controlled drop test simulation. The uniform stress–stain distribution is recorded maintaining the no-ring phenomenon by selecting optimal shock pulse parameters. Selected impact/shock pulse is decided by identifying the maximum impact energy absorbed by the board during the drop event. Board surface strain and stress data are captured 1–2 mm away near the components are quantified for higher strain rate. The board local strain rate on the board surface is recorded at a selected time-step to quantify the dynamic stresses along the component side surface on the board. The simulation is performed by using ANSYS software using implicit method. Both linear SOLID45 and quadratic SOLID95 elements are used to compare and correlate the results. Close forms of results were correlated with the previous theoretical results.

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His research interests include Engineering Education, Computer haptics, CAD/CAM, high performance computing, meta-heuristics, multi-axis NC surface machining.

This paper presents an example of incorporating a research project in the undergraduate system dynamics course. The research topic is in the area of drop impact reliability for the handheld electronic products. Portable electronic devices are prone to accidental drops during their service life. Board level solder joint reliability during drop impact is a great concern to electronic product manufacturers. The drop test has become a key qualification test for portable electronic products in recent years. However, actual drop test is very expensive and time-consuming. It requires much manpower in measurement and failure analysis. An alternative approach is to develop analytical dynamic models and to perform numerical simulations. The drop impact test can be simplified as a single degree of freedom dynamic system. The project of modeling and simulation for the drop impact test is assigned in the class. In the paper, the description, implementation and assessment of the teaching are presented. The results of implementation of the projects were very promising.