We report the current-voltage (I-V) and capacitance-voltage characteristics (C-V) of Ni/n-GaN Schottky diodes. Gallium nitride is a highly promising wide band gap semiconductor for applications in high power electronic and optoelectronic devices which require Schottky barriers for modulating the channel mobile charge. The I-V and C-V characteristics of the diodes have been measured in the temperature range of 80–400 K with steps of 20 K. Thermal carrier concentration and barrier height versus temperature plots have been obtained from the C−2-V characteristics, and a value of α=−1.40 meV/K for temperature coefficient of the barrier height. The modified activation energy plot according to the barrier inhomogeneity model has given the Richardson constant A∗ as 80 or 85 A/(cm2 K2).

We have studied the admittance and current-voltage characteristics of the Au/Ti/Al 2 O 3 /n-GaAs structure. The Al 2 O 3 layer of about 5 nm was formed on the n-GaAs by atomic layer deposition. The barrier height (BH) and ideality factor values of 1.18 eV and 2.45 were obtained from the forward-bias ln I vs V plot at 300 K. The BH value of 1.18 eV is larger than the values reported for conventional Ti/n-GaAs or Au/Ti/n-GaAs diodes. The barrier modification is very important in metal semiconductor devices. The use of an increased barrier diode as the gate can provide an adequate barrier height for FET operation while the decreased barrier diodes also show promise as small signal zero-bias rectifiers and microwave. The experimental capacitance and conductance characteristics were corrected by taking into account the device series resistance R s. It has been seen that the noncorrection characteristics cause a serious error in the extraction of the interfacial properties. Furthermore, the device behaved more capacitive at the reverse bias voltage range rather than the forward bias voltage range because the phase angle in the reverse bias has remained unchanged as 901 independent of the measurement frequency.

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The Ni/p-InP Schottky diodes (SDs) have been prepared by DC magnetron sputtering deposition. After the diode fabrication, they have been thermally annealed at 700 °C for 1 min in N2 atmosphere. Then, the current–voltage characteristics of the annealed and non-annealed (as-deposited) SDs have been measured in the measurement temperature range of 60–400 K with steps of 20 K under dark conditions. After 700 °C annealing, an improvement in the ideality factor value has been observed from 60 to 200 K and the barrier height (BH) value approximately has remained unchanged in the measurement temperature range of 200–400 K. The BH of the annealed diode has decreased obeying the double-Gaussian distribution (GD) of the BHs with decreasing measurement temperature from 200 to 60 K. The BH for the as-deposited diode has decreased with decreasing temperature obeying the single-GD over the whole measurement temperature range. An effective Richardson constant value of 54.21 A/cm2K2 for the as-deposited SD has been obtained from the modified Richardson plot by the single-GD plot, which is in very close agreement with the value of 60 A/K2cm2 for p-type InP. The series resistance value of the annealed SD is lower than that of the non-annealed SD at each temperature and approximately has remained unchanged from 140 to 240 K. Thus, it can be said that an improvement in the diode parameters has been observed due to the thermal annealing at 700 °C for 1 min in N2 atmosphere.