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A novel characterization method for the nitrogen doping concentration in heavily nitrogen-doped (more than 1 × 10 19 cm −3 ) 4H-SiC crystals using Raman scattering microscopy is proposed. The method utilizes the integrated intensity of the longitudinal optical phonon-plasmon coupled (LOPC) mode signal arising at 1100 cm −1 , which exhibits marked changes in the peak position, intensity, and line shape when the nitrogen concentration in 4H-SiC crystals changes. The proposed method showed a much higher sensitivity to the nitrogen doping variation in 4H-SiC crystals compared to the conventional characterization methods using the LOPC peak shift and the Fano interference, and detected a small variation (∼1%) in the nitrogen doping concentration across the (000 1) facet of heavily nitrogen-doped 4H-SiC crystals.

The annealing behavior of electrical resistivities perpendicular and parallel to the basal plane of heavily nitrogen-doped 4H-SiC crystals was investigated. The temperature dependencies of the resistivities exhibited characteristic behaviors after multiple rounds of high-temperature annealing (1100°C, 30 min). High-temperature annealing induced stacking fault formation to various extents in heavily nitrogen-doped 4H-SiC crystals. Based on these results, we discuss the cause and mechanism of the observed annealing-induced changes in electrical resistivities of the crystals.

The defect structure at the growth front of 4H-SiC boules grown using the physical vapor transport (PVT) method has been investigated using high resolution x-ray diffraction and x-ray topography. The crystal parameters such as the c-lattice constant exhibited characteristic variations across the growth front, which appeared to be caused by variation in surface morphology of the as-grown surface of the boules rather than the defect structure underneath the surface. X-ray topography also revealed that basal plane dislocations are hardly nucleated at the growth front during PVT growth of 4H-SiC crystals.