The surface loss probabilities of the dominant neutral growth species emanating from methane and acetylene discharges are investigated by depositing thin films inside a cavity. The walls of this cavity are made from silicon substrates. Particles from the plasma can enter the cavity through a slit. The surface loss probability is determined by analysis of the deposition profile inside the cavity. This surface loss probability corresponds to the sum of the probability for effective sticking on the surface and the probability for the formation of a nonreactive volatile product via surface reactions. In a methane discharge the surface loss probability is ∼0.65±0.15 and in an acetylene discharge ∼0.92±0.05, respectively. The dominant contribution in the neutral radical flux emanating from a methane discharge towards the surface consists of CH3 radicals, as known from experiments using mass spectrometry. Furthermore, it is known from literature that the upper limit for the reaction probability for CH3 is in the range of 10−2. This leads us to the conclusion that the CH3 radical is not the dominant neutral growth precursor in a methane discharge. This result refutes the widely accepted picture that CH3 radicals are the dominant neutral growth precursor in a-C:H growth from methane. From a comparison of the composition of the neutral flux towards the surface from methane and acetylene discharges, we conclude that in both cases C2Hy species are the dominant neutral precursors for film growth.
Mass spectrometric and Langmuir probe measurements reveal that the plasma chemistry of an expanding Ar/C2H2 plasma which is used for deposition of hydrogenated amorphous carbon is dominated by argon ion-induced dissociation of the precursor gas. The ion-induced dissociation is very efficient leading to complete depletion under certain conditions. The ion fluence as determined from modeling the mass spectrometry results is in good agreement with Langmuir probe measurements suggesting a one-to-one relation between the argon ion and acetylene consumption. The good correlation found between the growth rate and the acetylene consumption rate expresses the efficient use of the dissociation products.
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Fabrication of tapered graded-refractive-index micropillars using ion-implanted-photoresist as an etch maskPhotoresist is etched using a remote thermal ͑cascaded arc͒ plasma in Ar/O 2 and Ar/O 2 N 2 mixtures. Very high etch rates, up to 200 nm/s, are achieved at low substrate temperatures ͑350 K͒ and low electron and ion temperatures ͑Ͻ0.5 eV͒. The addition of small amounts of nitrogen ͑3%͒ leads to an increase in etch rate. The etch rate in Ar/O 2 /N 2 also increases with time during the etching process. The details of the plasma and surface chemistries are not yet well understood.
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