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Gold wire has been high volume production in IC packaging industry. With soaring price of gold in recent years and IC packaging search for cost reduction, 2nd alternative for wire bonding type assembly. But copper wire has drawbacks in control issues such as pad crack, aluminum splash, cratering and low throughput, Cu wire need a more complex multi-processing program problems, even if copper raw material cost is low, the process costs are increased These limitations of copper wire thickness and structure. Silver alloy wire alternative as the cost can compete with copper and the properties of silver are nearly identical to gold while to die package which benefits will be more apparent Many Study had performed for Silver alloy wire (88% & 95%), included the general workability, wire pull, ball shear, Al splash, pad-to-pad bonding. To get good workability result, Silver alloy wire properties have been studied and DOE to determine the best material properties windows. The key properties included the element composition and elongation, hardness, etc.

Flip chip technology has been developed for more than 30 years and is widely used today in the assembly of high-performance devices that require good functionality on substrate space. Compared to traditional wire bonding interconnection, flip chip technology offers tremendous advantages such as eliminating wire bond connections, increasing inputloutput (I/O) density, and using less space on substrates. With the rapid growth in flip chip technology, the need for assembly services has been developed. The key challenge in flip chip technology development is to improve the reliability of flip chip assembly. To enhance reliability, underfill materials are applied to the gap between die and substrate to 0-7803-7220-4/01/$10.00 02001 IEEE

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