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Due to the current requirement of high recording density of hard disk drive, the thickness of DLC layer which is the protective layer is needed to be reduced. Therefore, the corrosion of read-write elements that are fabricated from soft magnetic materials is more critical. During the photolithography process, polymer photoresist is playing the major role on controlling the corrosion of soft magnetic materials. Two different types of polymer photoresists are selected to investigate, noted as wet photoresist and dry photoresist, respectively. Contact angle measurement, AFM and SEM are techniques using to determine the quality of polymer photoresists. Furthermore, the direct corrosion is also studied by using potentiostat/galvanostat-based measurements. The result suggested that the wet photoresist, AZ4999 Clariant, is better as compared to that of dry photoresist. No surface degradation as well as surface defects of the wet photoresist was found after lithography process. The corrosion rate of the specimen coated by this corresponding wet film is found to be only 1.44 x 10(-6) mm/y. In addition, the wet photoresist surface is hydrophobic posed of more than 75 degree of contact angle.

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3D surface topography of read / write head fabrication is difficult for lithography process. Photoresist deposition by using the conventional spin coating method is troubled. Spray coating is a replacement technique that eliminates the problem by producing micro-resist droplets that adhere firmly to the deposition location; thus, spray coating with optimal parameters from designed experiment is a suitable method for photoresist deposition on structures with high aspect ratio. By using proper nitrogen flow rate to spread out AZ4999 resist to be micro-droplet in the same time with proper traveling nozzle speed, the photoresist turbulence will perform good resist coverage over all surfaces. From design of experiment show the optimum condition for conformal deposition is 0.8 Bar at 117mm/s for nitrogen pressure and nozzle speed, respectively. Photoresist thickness was dropped at 30um far away from groove or edge of the head.