Full-scale quantum computers require the integration of millions of qubits, and the potential of using industrial semiconductor manufacturing to meet this need has driven the development of quantum computing in silicon quantum dots. However, fabrication has so far relied on electron-beam lithography and, with a few exceptions, conventional lift-off processes that suffer from low yield and poor uniformity. Here we report quantum dots that are hosted at a 28Si/28SiO2 interface and fabricated in a 300 mm semiconductor manufacturing facility using all-optical lithography and fully industrial processing. With this approach, we achieve nanoscale gate patterns with excellent yield. In the multi-electron regime, the quantum dots allow good tunnel barrier control—a crucial feature for fault-tolerant two-qubit gates. Single-spin qubit operation using magnetic resonance in the few-electron regime reveals relaxation times of over 1 s at 1 T and coherence times of over 3 ms.

We investigate the structural and quantum transport properties of isotopically enriched 28 Si/ 28 SiO 2 stacks deposited on 300-mm Si wafers in an industrial CMOS fab. Highly uniform films are obtained with an isotopic purity greater than 99.92%. Hall-bar transistors with an oxide stack comprising 10 nm of 28 SiO 2 and 17 nm of Al 2 O 3 (equivalent oxide thickness of 17 nm) are fabricated in an academic cleanroom. A critical density for conduction of 1.75 × 10 11 cm −2 and a peak mobility of 9800 cm 2 /Vs are measured at a temperature of 1.7 K. The 28 Si/ 28 SiO 2 interface is characterized by a roughness of = 0.4 nm and a correlation length of = 3.4 nm. An upper bound for valley splitting energy of 480 μeV is estimated at an effective electric field of 9.5 MV/m. These results support the use of wafer-scale 28 Si/ 28 SiO 2 as a promising material platform to manufacture industrial spin qubits.

No abstract

No abstract

No abstract