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We have developed a novel class ofprojection lithography systems that provide both high-throughput resist patterning and dielectric via formation for production ofa variety ofelecironic modules, including flat-panel displays (FPD's), multichip modules (MCM's), printed circuit boards (PCB's), and microelectromechanical systems (MEMS). The new technology eliminates limitations of current lithography tools, including contact and proximity tools, conventional projection systems, steppers and scanners, and direct-write machines. Further, the new system concept is highly modular, thereby providing equipment upgradability as well as choice ofuser-specified system configurations. These results are achieved with a novel, hexagonal seamless scanning concept and a single-planar stage system configuration that provide both high optical and scanning efficiencies, and combine high-resolution imaging with very large exposure area capability. We describe the new technology and present experimental results. These lithography systems are highly attractive for cost-effective production of microelectronic products with feature sizes ranging from 15 xm to below 1 jtm and substrate sizes ranging from 1 50 x 150 mm to larger than 610 x 660 mm. -We have developed a novel class of projection lithography systems that provide both high-throughput, high-resolution resist patterning and dielectric via formation for fabrication of 0277-786X198/$1O.QO SPIE Vol. 3331 / 197 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 05/14/2015 Terms of Use: http://spiedl.org/terms

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