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We report on the deposition of copper oxide by atomic layer deposition (ALD) using copper acetylacetonate (Cu(acac) 2 ) and ozone (O 3 ) as precursors. The aim is to deposit oxides of copper as possible candidates for materials in all-oxide photovoltaics. The present study results in ALD-type deposition of the tenorite phase of copper(II) oxide in a temperature window of 150 8C to ca. 230 8C, with a growth rate of $0.038 nm per cycle. The resulting ALD characteristics, with a relatively large ALD window in deposition temperature, should be well suited for combination with additional deposition processes for the formation of complex compounds. The film thickness is studied using X-ray reflectivity (XRR), and phase is determined by X-ray diffraction (XRD). Surface roughness is studied using atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS) is used to investigate the chemical state of the deposited films.

Highly doped n-type ZnO films have been grown on n-type and p-type Si substrates by atomic layer deposition (ALD). Transmission electron microscopy shows columnar growth of the ZnO films with randomly oriented grains and a very thin interfacial layer of SiO x (x ⩽ 2) with a thickness below 0.4 nm to the Si substrate. Current–voltage and capacitance–voltage measurements performed at temperatures from 50 to 300 K reveal a strong rectifying behaviour on both types of substrates with an ideality factor close to unity between 180 and 280 K. Using the classical approach of thermionic emission, the barrier heights of the ZnO/n-Si and ZnO/p-Si junctions have been deduced and consistent values are obtained yielding a work function of n-type ZnO close to 4.65 eV.

ZnO/n-Si and ZnO/p-Si heterostructures were prepared by Atomic layer deposition (ALD) and the electronic properties have been investigated by Current-Voltage (I-V), Capacitance-Voltage (C-V) and Deep level transient spectroscopy (DLTS) measurements. DLTS measurements show two dominants electron traps at the interface of the ZnO/n-Si junction with energy position at 0.07 eV and 0.15 eV below the conduction band edge, labelled E(0.07) and E(0.15), respectively, and no electrically active defects at the interface of the ZnO/p-Si junction. E(0.07) is reduced by annealing up to 400°C while E(0.15) is created at 500°C. The best heterostructure is found after heat treatment at 400°C with a substantial improvement of the current rectification for ZnO/n-Si and the formation of Ohmic contact on ZnO/p-Si. A reduction of the interface defects correlates with an improvement of the crystal structure of the ZnO film with a preferred orientation along the c-axis.