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Resistive Random Access Memory (ReRAM) is a novel form of non-volatile memory with a variety of applications ranging from neuromorphic circuits used for artificial intelligence applications, to a potential replacement for flash memory. Each application has specific requirements including R off /R on ratio, maximum variability tolerance, retention, endurance, and operating voltages. Tuning of individual performance metrics for a particular application often results in performance trade-offs. In this work, we demonstrate the adjustment of the abovementioned parameters via manipulation of the pre-forming oxygen vacancy gradient using a controlled annealing step with nanoscale HfO 2 -based ReRAM devices. ReRAM devices of 100×100 nm 2 were implemented between the metal 1 and 2 interconnect in a custom designed split via process, using 65 nm CMOS processing technology. A temperature study on these devices was performed to optimize the oxygen vacancy gradient from the switching layer to the oxygen scavenger layer. Devices in a 1 transistor/1 ReRAM (1T1R) configuration were subjected to 300 °C-400 °C, for 1-120 min and then electrically characterized using DC switching and endurance testing. Based on the results of this study, we outline the temperature constraints for post-fabrication drive-in of oxygen vacancies via annealing-based treatment of HfO 2 based ReRAM devices.

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