Nobuaki Tarumi scite author profile

Nobuaki Tarumi

5Publications

34Citation Statements Received

0Citation Statements Given

How they've been cited

How they cite others

Affiliations

Nagoya University

Publications

Order By: Most citations

Amorphous Ru / Polycrystalline Ru Highly Reliable Stacked Layer Barrier Technology

Ogawa¹,

Tarumi²,

Abe³

et al. 2008

View full text Add to dashboard Cite

An amorphous Ru (a-Ru) underneath polycrystalline Ru (p-Ru) stacked barrier structure (a-Ru/p-Ru ) is proposed as a highly reliable barrier metal technology. The a-Ru with less grain boundary contacted to a dielectric layer showed higher barrier property than a conventional TaN/Ta or the p-Ru barrier, and the p-Ru layer with high adhesion to Cu material contacted to Cu interconnect showed three orders magnitude longer electro-migration life time than the TaN/Ta barrier.

show abstract

Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance

Takigawa¹,

Tarumi²,

Shiohara³

et al. 2011

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

Thin low-k SiOC(N) dielectric / ruthenium stacked barrier technology

Tarumi¹,

Oda²,

Kondo³

et al. 2009

View full text Add to dashboard Cite

Feasibility study of 70nm pitch Cu/porous low-k D/D integration featuring EUV lithography toward 22nm generation

Nakamura¹,

Oda²,

Soda³

et al. 2009

View full text Add to dashboard Cite

Cu / Barrier Metal Stack Film Characterization for Reliability Estimation

Ogawa

Ohdaira

Hosoi³

et al. 2007

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Nobuaki Tarumi

Amorphous Ru / Polycrystalline Ru Highly Reliable Stacked Layer Barrier Technology

Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance

Thin low-k SiOC(N) dielectric / ruthenium stacked barrier technology

Feasibility study of 70nm pitch Cu/porous low-k D/D integration featuring EUV lithography toward 22nm generation

Cu / Barrier Metal Stack Film Characterization for Reliability Estimation

Contact Info

Product

Resources

About