We report on the demonstration of a silicon-based quantum cellular automata (QCA) unit cell incorporating two pairs of metallically doped (n+) phosphorus-implanted nanoscale dots, separated from source and drain reservoirs by nominally undoped tunnel barriers. Metallic cell control gates, together with Al–AlOx single electron transistors for noninvasive cell-state readout, are located on the device surface and capacitively coupled to the buried QCA cell. Operation at subkelvin temperatures was demonstrated by switching of a single electron between output dots, induced by a driven single electron transfer in the input dots. The stability limits of the QCA cell operation were also determined.

The radio frequency single electron transistor (rf-SET) possesses key requirements necessary for reading out a solid state quantum computer. This work explores the use of the rf-SET as a singleshot readout device in the presence of 1/f and telegraph charge noise. For a typical spectrum of 1/f noise we find that high fidelity, single-shot measurements are possible for signals ∆q > 0.01e. For the case of telegraph noise, we present a cross-correlation measurement technique that uses two rf-SETs to suppress the effect of random switching events on readout. We demonstrate this technique by monitoring the charge state of a metal double dot system on microsecond time-scales. Such a scheme will be advantageous in achieving high readout fidelity in a solid state quantum computer.

We review progress at the Australian Centre for Quantum Computer Technology towards the fabrication and demonstration of spin qubits and charge qubits based on phosphorus donor atoms embedded in intrinsic silicon. Fabrication is being pursued via two complementary pathways: a 'top-down' approach for near-term production of few-qubit demonstration devices and a 'bottom-up' approach for large-scale qubit arrays with sub-nanometre precision. The 'top-down' approach employs a low-energy (keV) ion beam to implant the phosphorus atoms. Single-atom control during implantation is achieved by monitoring on-chip detector electrodes, integrated within the device structure. In contrast, the 'bottom-up' approach uses scanning tunnelling microscope lithography and epitaxial silicon overgrowth to construct devices at an atomic scale. In both cases, surface electrodes control the qubit using voltage pulses, and dual single-electron transistors operating near the quantum limit provide fast read-out with spurious-signal rejection.