No abstract

Initial tests of a building technology for a compact three-dimensional mass producible microrobot are presented. The 3.9 × 3.9 × 3.3 mm 3 sized prototype robot represents a microsystem with actuators, sensors, energy management and integrated electronics. The weight of a folded robot is 65 mg and the total volume is less than 23 mm 3 . The design of the interfaces of the different modules in the robot, as well as the building technology, is described. The modules are assembled using conductive adhesive with industrial surface mounting technology on a thin double-sided flexible printed circuit board. The final shape of the microrobots is achieved by folding the flexible printed circuit board twice. Electrical and mechanical studies are performed to evaluate the assembly and it is concluded that the technology can be used for this type of microsystem. Several issues using the presented assembly technique are identified and addressed.

This paper presents a HV/HR-MAPS detector developed in the framework of the HV-CMOS collaboration for the ATLAS Inner Tracker update of the HL-LHC era. It was fabricated with a 150 nm HV-CMOS process which includes a layer to isolate the bulk of the PMOS transistors from the collecting node of the sensor. All the front-end electronics is integrated in the pixel, which is of only 50 µm x 50 µm, and include a preamplifier, shaper, discriminator and digital block with FEI3 column drain architecture.

Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected using deep n-wells as sensor diodes with the depleted region extending into the silicon bulk. Both analog and digital readout electronics can be added to achieve different levels of integration up to a fully monolithic sensor. Small scale prototypes using the ams CMOS technology have previously demonstrated that it can achieve the required radiation tolerance of 10 15 n eq /cm 2 and detection efficiencies above 99.5 %. Recently, large area prototypes, comparable in size to a full sensor, have been produced that include most features required towards a final design: the H35demo prototype produced in ams H35 technology that supports both external and integrated readout and the monolithic ATLASPix1 pre-production design produced in ams aH18 technology. Both chips are based on large fillfactor pixel designs, but differ in readout structure. Performance results for H35DEMO with capacitively-coupled external readout and first results for the monolithic ATLASPix1 are shown.

The H35DEMO chip is a HV/HR-MAPS demonstrator of 18.49 mm x 24.4 mm, fabricated with a 0.35 µm HVCMOS process from AMS in four different substrate resistivities. The chip is divided into four independent matrices with a pixel size of 50 µm x 250 µm. Two of the matrices are fully monolithic and include the digital readout electronics at the periphery. This contribution describes the two standalone matrices of the H35DEMO chip and presents results of the beam tests carried out with unirradiated and irradiated samples with different substrate resistivities.