Deep level optical spectroscopy (DLOS) and deep level transient spectroscopy (DLTS) measurements performed on Ni/β-Ga2O3 Schottky diodes fabricated on unintentionally doped (010) substrates prepared by edge-defined film-fed growth revealed a rich spectrum of defect states throughout the 4.84 eV bandgap of β-Ga2O3. Five distinct defect states were detected at EC − 0.62 eV, 0.82 eV, 1.00 eV, 2.16 eV, and 4.40 eV. The EC − 0.82 eV and 4.40 eV levels are dominant, with concentrations on the order of 1016 cm−3. The three DLTS-detected traps at EC − 0.62 eV, 0.82 eV, and 1.00 eV are similar to traps reported in Czochralski-grown β-Ga2O3, [K. Irmscher et al., J. Appl. Phys. 110, 063720 (2011)], suggesting possibly common sources. The DLOS-detected states at EC − 2.16 eV and 4.40 eV exhibit significant lattice relaxation effects in their optical transitions associated with strongly bound defects. As a consequence of this study, the Ni/β-Ga2O3 (010) Schottky barrier height was determined to be 1.55 eV, with good consistency achieved between different characterization techniques.

The impact of C incorporation on the deep level spectrum of n-type and semi-insulating GaN:C:Si films grown by rf plasma-assisted molecular-beam epitaxy (MBE) was investigated by the combination of deep level transient spectroscopy, steady-state photocapacitance, and transient deep level optical spectroscopy. The deep level spectra of the GaN:C:Si samples exhibited several band-gap states. A monotonic relation between systematic doping with C and quantitative trap concentration revealed C-related deep levels. A deep acceptor at Ec−2.05eV and a deep donor at Ec−0.11eV are newly reported states, and the latter is the first directly observed deep level attributed to the CGa defect. A configuration-coordinate model involving localized lattice distortion revealed strong evidence that C-related deep levels at Ec−3.0eV and Eν+0.9eV are likely identical and associated with the yellow luminescence in C-doped GaN films. Of the deep levels whose trap concentration increase with C doping, the band-gap states at Ec−3.0 and 3.28eV had the largest concentration, implying that free-carrier compensation by these deep levels is responsible for the semi-insulating behavior of GaN:C:Si films grown by MBE. The differing manner by which C incorporation in GaN may impact electrical conductivity in films grown by MBE and metal-organic chemical-vapor deposition is discussed.

The effect of excess C incorporation on the deep level spectrum of n-type GaN grown by metalorganic chemical vapor deposition was investigated. Low-pressure (LP) growth conditions were used to intentionally incorporate excess C compared to atmospheric pressure (AP) growth conditions. GaN samples with high C content are found to be highly resistive, and samples codoped with C and Si are heavily compensated. From a comparison of deep level optical spectroscopy and deep level transient spectroscopy measurements of the LP-grown codoped GaN:C:Si sample with the AP-grown unintentionally doped GaN, two deep levels at Ec−Et=1.35 and 3.28 eV are observed to have a direct relation to excess C incorporation. Comparing these activation energies to previous theoretical studies strongly suggests that the levels may be associated with a C interstitial and CN defect, respectively. These results suggest that C forms not only a shallow acceptor level but also a deep acceptor level in GaN, and these levels contribute to the compensation of the free carriers in n-type GaN:C.

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GaP films were grown on offcut Si(001) substrates using migration enhanced epitaxy nucleation followed by molecular beam epitaxy, with the intent of controlling and eliminating the formation of heterovalent (III-V/IV) nucleation-related defects—antiphase domains, stacking faults, and microtwins. Analysis of these films via reflection high-energy electron diffraction, atomic force microscopy, and both cross-sectional and plan-view transmission electron microscopies indicate high-quality GaP layers on Si that portend a virtual GaP substrate technology, in which the aforementioned extended defects are simultaneously eliminated. The only prevalent remaining defects are the expected misfit dislocations due to the GaP–Si lattice mismatch.