We have developed a compact dual-band (2.45 GHz) power-amplifier module with a concurrent 8OZ.llaWg) WLANs. The proposed diplexer-matching network is three-dimensionally implemented i n an LTCC of 20 dBm at 2. 4 GH& and 1s dgm at 5 2 5 G H~ with an E V M 0144% for a 54-Mbps OFDM signal. Our approach of using a concurrent dual-band PA reduces the size and cost by D * almost half compared with using a conventional parallelIn this paper, we present a compact dual-band PA module with a single amplifier chain for IEEE802.1 laiblg output-networks are three-dimensionally integrated in a substrate, which enables us to reduce the module size to 5x 5 x 1.4 mm. The PA module exhibits sufficient output power, compliant with a strict error vector magnitude (EVM) specification, for both the 2.4-and 5-GHz bands, . JdaP/GaAs HBT lor triPle-mde (*EEE WLAN systems, The proposed diplexer input-and subtrate (5 5 , , ,The ,,,duie exhibib an output power multi-layer low temperature co-fired ceramic (LTCC) 1 m.without requiring any external components or band-selecting switch, hder Terms -Diplerer, dual-band, impedance matching, LTCC. power amplifiers. wireless LANs. CIRCUIT DESIGN

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