A positive-tone and aqueous-base-developable benzocyclobutene (BCB)-based dielectric material curable in air is described in this paper. The prepolymer is made from divinylsiloxane bisbenzocyclobutene (DVS-bisBCB) and BCB-acrylic acid. The formulation contains antioxidants that allow the prepolymer to cure in air and a diazonaphthaquinone to make it photosensitive. Patterned films have high resolution, and via openings are scum-free without a descum operation. Whether cured in nitrogen or in air, the prepolymer produces a film with optical, electrical, thermal, and mechanical properties desirable for many microelectronic applications, such as packaging applications and as a planarization or insulation layer in display applications.

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The advanced packaging application space continues to evolve as mobile devices pack more and more features into a limited space. This feature concentration is causing a deviation from the conventional shrinkage pathway predicted by Moore's law which, in turn, requires dielectric materials with ever more rigid thermal, chemical, and mechanical properties to meet the challenging requirements of next generation packages such as TSV and 3D chip stacking. One such challenge is the thinner substrates required for vertical integration in TSV and 3D packages. Cured dielectrics impart stress onto the underlying substrate and this wafer bow will only magnify with thinner substrates. Designing photodielectrics with inherently lower residual stress will greatly aide in the development of materials to meet future advanced packaging needs. This presentation will outline the development of a new photodielectric material that builds upon the excellent thermal, electrical, and chemical stability of BCB-based materials while providing a significant reduction in residual stress.