We apply ultra‐short pulse laser ablation to create local contact openings in thermally grown passivating SiO2 layers. This technique can be used for locally contacting oxide passivated Si solar cells. We use an industrially feasible laser with a pulse duration of τpulse ∼ 10 ps. The specific contact resistance that we reach with evaporated aluminium on a 100 Ω/sq and P‐diffused emitter is in the range of 0·3–1 mΩ cm2. Ultra‐short pulse laser ablation is sufficiently damage free to abandon wet chemical etching after ablation. We measure an emitter saturation current density of J0e = (6·2 ± 1·6) × 10−13 A/cm2 on the laser‐treated areas after a selective emitter diffusion with Rsheet ∼ 20 Ω/sq into the ablated area; a value that is as low as that of reference samples that have the SiO2 layer removed by HF‐etching. Thus, laser ablation of dielectrics with pulse durations of about 10 ps is well suited to fabricate high‐efficiency Si solar cells. Copyright © 2007 John Wiley & Sons, Ltd.

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In recent years, poly-Si based passivated contacts elevated the conversion efficiencies of crystalline Si solar cells to levels of 26%abs due to their outstanding electrical surface passivation performance and current transport characteristics. A major associated challenge, however, is the large parasitic light absorption within the doped poly-Si, regardless if the contacts are applied on the front and/or on the rear side of the solar cell. It, therefore, might be beneficial to confine the passivated contacts to local regions underneath the metal contacts. We present an effective and flexible laser-based approach to structure the poly-Si layer after its full-area deposition. Laser pulses with a pulse duration of 9 ps and a wavelength of 355 nm trigger an amorphization of the poly-Si surface. The minimum threshold fluence for amorphization is between 89 and 129 mJ/cm2. The a-Si layer, which is laterally homogeneous and up to (33 ± 4) nm in thickness, works as an etch barrier in an alkaline solution. The most robust barrier corresponding to the maximum thickness of the a-Si layer is found for a fluence of (270 ± 30) mJ/cm2. Besides the impact of the laser fluence on the etch resistiveness of the modified poly-Si layer, we study the role of oxygen during the laser process. We find that oxygen becomes incorporated into the material for certain laser fluences, which results in a more robust etch barrier. The amount of oxygen incorporated is below 3 wt. %. Eventually, we present a phenomenological model of our findings.