Domain walls (DWs) in ferroelectric/ferroic materials have been a central research focus for the last 50 years; DWs bear a multitude of extraordinary physical parameters within a unit-cell-sized lateral confinement. Especially, one outstanding feature has recently attracted a lot of attention for room-temperature applications, which is the potential to use DWs as two-dimensional (2D) conducting channels that completely penetrate bulk compounds. Domain wall currents in lithium niobate (LNO) so far lie in the lower pA regime. In this work, we report on an easy-to-use and reliable protocol that allows enhancing domain wall conductivity (DWC) in single-crystalline LNO (sc-LNO) by 3 to 4 orders of magnitude. sc-LNO thus has become one of the most prospective candidates to engineer DWC applications, notably for domain wall transport both with and without photoexcitation. DWs were investigated here for several days to weeks, both before and after DWC enhancement. 2D local-scale inspections were carried out using adequate local-probe techniques, i.e., piezoresponse force microscopy and conductive atomic force microscopy, while Cerenkov second-harmonic generation was applied for mapping the DW constitution in three-dimensional space across the full LNO single crystal. The comparison between these nano- and microscale inspections allows us to unambiguously correlate the DW inclination angle α close to the sample surface to the measured domain wall current distribution. Moreover, ohmic or diode-like electronic transport characteristics along such DWs can be readily interpreted when analyzing the DW inclination profile.

No abstract

The discovery of ferroelectricity in thin doped hafnium oxide films revived the interest in ferroelectric (FE) memory concepts. Zirconium‐doped hafnium oxide (HZO) crystallizes at low temperatures (e.g., 400 °C), which makes this material interesting for the implementation of FE functionalities into the back end of line (BEoL). So far, the FE phase of prior amorphous HZO films is achieved by using a dedicated rapit thermal annealing (RTA) treatment. However, herein, it is shown that this dedicated anneal is not needed. A sole furnace treatment given by the thermal budget present during the interconnect formation is sufficient to functionalize even ultrathin 5 nm HZO films. This result helps to optimize the integration sequence of HZO films (e.g., involving a minimum number of BEoL process steps), which saves process time and fabrication costs. Herein, metal–FE–metal capacitors with Hf0.5Zr0.5O2 films of different thicknesses (5–20 nm) are fabricated annealed at 400 °C for various durations within different types of ovens (RTA and furnace). Structural and electrical characterization confirms that all furnace‐annealed samples have similar X‐ray diffraction patterns, remanent polarization, endurances, and thickness dependencies as RTA‐annealed ones. With respect to remanent polarization, leakage current, and endurance, the HZO film of 10 nm thickness shows the most promising results for the integration into the BEoL.

Research data are not shared.

The local crystal phase and orientation of ferroelectric grains inside TiN/Hf0.5Zr0.5O2/TiN have been studied by the analysis of the local electron beam scattering Kikuchi patterns, recorded in transmission. Evidence was found that the ferroelectric phase of the layers is derived from an orthorhombic phase, most likely of space group Pca21. The orientation analysis reveals a strong out-of-plane texture of the polycrystalline film which is in accordance with a high remanent polarization Pr observed for P-V measurements. The results of this analysis help us to further optimize the ratio of ferroelectric grains and their orientation for many applications, e.g., in the field of emerging memory or infrared sensors.