Defect chemistry and transport in Fe-doped SrTiO 3 single crystal are studied to understand its resistance degradation mechanism. The temporal evolution of electric conductivity under a voltage stress was obtained computationally by solving the transport equations for ionic and electronic defects coupled with the defect reaction equilibrium equations. The computational results are compared to the corresponding experimental measurement under similar conditions. It is shown that the local electron and hole concentrations are controlled by the local electronic defect equilibria rather than by their quasi-steady state diffusional transport. It is the electric field-induced migration of oxygen vacancies and the subsequent instantaneous reestablishment of the local defect equilibria that lead to the resistance degradation. The resistance degradation behavior and the defect distributions under a long-term voltage stress are strongly influenced by the sample-annealing oxygen partial pressure, degrading electric field, and temperature. The present study contributes to the understanding of resistance degradation mechanism and provides guidance to improve the lifetime and reliability of wide band-gap semiconducting capacitors.
The growth of Al 2 O 3 onto Sn-doped In 2 O 3 (ITO) by atomic layer deposition (ALD) was studied in situ using X-ray photoelectron spectroscopy. Significant diffusion of oxygen from the substrate destroys the self-terminated monolayer adsorption of the metal precursor and results in a nominal initial growth per cycle of >1 nm. The observed mechanism precludes the preparation of monolayer thick Al 2 O 3 films on ITO substrates by ALD. The energy band alignment at the ITO/Al 2 O 3 interface is significantly different from that obtained when magnetron sputtering is used for the deposition of Al 2 O 3 onto ITO [Gassenbauer et al., Phys. Chem. Chem. Phys. 2009, 11, 3049]. The difference is attributed to a pinning of the Fermi level in the ALD-Al 2 O 3 layer close to midgap, which is attributed to the incorporation of hydrogen in the film during growth.
The ionization potentials of In(2)O(3) films grown epitaxially by magnetron sputtering on Y-stabilized ZrO(2) substrates with (100) and (111) surface orientation are determined using photoelectron spectroscopy. Epitaxial growth is verified using x-ray diffraction. The observed ionization potentials, which directly affect the work functions, are in good agreement with ab initio calculations using density functional theory. While the (111) surface exhibits a stable surface termination with an ionization potential of ∼ 7.0 eV, the surface termination and the ionization potential of the (100) surface depend strongly on the oxygen chemical potential. With the given deposition conditions an ionization potential of ∼ 7.7 eV is obtained, which is attributed to a surface termination stabilized by oxygen dimers. This orientation dependence also explains the lower ionization potentials observed for In(2)O(3) compared to Sn-doped In(2)O(3) (ITO) (Klein et al 2009 Thin Solid Films 518 1197-203). Due to the orientation dependent ionization potential, a polycrystalline ITO film will exhibit a laterally varying work function, which results in an inhomogeneous charge injection into organic semiconductors when used as electrode material. The variation of work function will become even more pronounced when oxygen plasma or UV-ozone treatments are performed, as an oxidation of the surface is only possible for the (100) surface. The influence of the deposition technique on the formation of stable surface terminations is also discussed.
In this communication, the cold sintering process was applied to benefit the green body compaction of 8 mol%Y 2 O 3-stablized ZrO 2 ceramics (8Y-YSZ). Compared to conventionally processed ceramics, an enhanced densification behavior was demonstrated in cold sintering related ones following a second step conventional sintering process. Dense ceramics up to ~96% of theoretical density were achieved after sintering at 1200 ºC. The resulted ceramics demonstrated a fine microstructure with a grain size ~200 nm. A mechanical performance with a Vickers hardness of 13.6 GPa and a fracture toughness of 2.85 MPa m 1/2 was also reported.
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