The future of solid-state lighting relies on how the performance parameters will be improved further for developing high-brightness light-emitting diodes. Eventually, heat removal is becoming a crucial issue because the requirement of high brightness necessitates highoperating current densities that would trigger more joule heating. Here we demonstrate that the embedded graphene oxide in a gallium nitride light-emitting diode alleviates the selfheating issues by virtue of its heat-spreading ability and reducing the thermal boundary resistance. The fabrication process involves the generation of scalable graphene oxide microscale patterns on a sapphire substrate, followed by its thermal reduction and epitaxial lateral overgrowth of gallium nitride in a metal-organic chemical vapour deposition system under one-step process. The device with embedded graphene oxide outperforms its conventional counterpart by emitting bright light with relatively low-junction temperature and thermal resistance. This facile strategy may enable integration of large-scale graphene into practical devices for effective heat removal.

This letter reports on the implementation of multilayer graphene (MLG) as a current spreading electrode in GaN-based blue light-emitting diodes. We demonstrate two facile strategies to maneuver the electrical coupling between p-GaN layer and MLG. Using a work-function-tuned MLG and a thin gold (Au) metal interlayer, the current spreading and thus the device forward voltage are considerably improved. We attribute these improvements to the diminution in work function difference between p-GaN and MLG, the decrease of specific contact resistance, and the enhancement in the conductivity of MLG film as a result of doping. In addition, rapid thermal annealing at elevated temperature is found to provide additional pathway for enhanced carrier injection.

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This paper describes a detailed systematic study based on the fabrication and performance of InGaN/GaN blue light-emitting diodes (LEDs) with multilayer graphene film as a current spreading electrode. Two facile approaches to improve the electrical coupling between graphene and p-GaN layer are demonstrated. Using chemical charge transfer doping, the work function (Φ) of graphene is tuned over a wide range from 4.21 to 4.93 eV with substantial improvements in sheet resistance (R s). Compared with pristine graphene, the chemically modified graphene on p-GaN yields several appealing characteristics such as low specific contact resistance (ρc) and minimized barrier height. In addition, insertion of a thin gold interlayer between graphene and p-GaN profoundly enhances the contact properties at the interface. Combining these two approaches in a single LED, the current spreading and thus the device forward voltage (V f) are considerably improved comparable to that of an LED fabricated with an indium tin oxide electrode. The importance of pre-metal deposition oxygen plasma treatment and rapid thermal annealing in improving the contact characteristics is also addressed.

This study elucidates the correlation among conductivity of graphene and interface aspects in GaN light-emitting diodes (LEDs). Using a multilayer graphene of low sheet resistance, it is demonstrated that graphene alone can make ohmic contact with p-GaN without necessitating additional interlayer. Large-area blue LED with relatively low contact resistance in the order of 10−2 ohm-cm2 and improved forward voltage of 3.2 ± 0.1 V was realized irrespective of the use of the interlayer. The results from parallel evaluation experiments performed by varying the layer numbers of graphene with ultrathin NiOx interlayer revealed that the poor lateral conductivity of monolayer or few layer graphene can be well compensated by the interlayer. A combination of three layer graphene and NiOx offered device with enhanced electro-optical performance. But the Schottky barrier associated with the inadequate adhesion of transferred graphene dominates all the benefits and becomes a major bottleneck preventing the formation of low resistance stable ohmic contact.