2006 International Electron Devices Meeting 2006
DOI: 10.1109/iedm.2006.346845
|View full text |Cite
|
Sign up to set email alerts
|

A 0.127 &amp;#x003BC;m<sup>2</sup> High Performance 65nm SOI Based embedded DRAM for on-Processor Applications

Abstract: We present a 65nm embedded DRAM cell (0.127 µm 2 cell size) on unpatterned SOI fabricated using standard high performance SOI technology with dual stress liner (DSL) (1). The cell utilizes a low-leakage 2.2-nm gate oxide pass transistor and a deep trench capacitor. A trench side wall spacer process enables a simplified collarless process. Connection to the buried plate is realized by silicided substrate guardrings with fully landed tungsten contacts. The bitline structure and the deep trench capacitor are desi… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
13
0

Year Published

2008
2008
2017
2017

Publication Types

Select...
4
3
1

Relationship

1
7

Authors

Journals

citations
Cited by 15 publications
(13 citation statements)
references
References 1 publication
0
13
0
Order By: Relevance
“…Growing integration densities have made it feasible to also implement embedded Dynamic RAM (e-DRAM) cores [1]- [3]. The configuration of a wordorganized embedded DRAM is illustrated in Figure 1.…”
Section: Introductionmentioning
confidence: 99%
“…Growing integration densities have made it feasible to also implement embedded Dynamic RAM (e-DRAM) cores [1]- [3]. The configuration of a wordorganized embedded DRAM is illustrated in Figure 1.…”
Section: Introductionmentioning
confidence: 99%
“…With the continually growing need to an effective and economic embedded-memory core in the SoC era, researchers attempt to carry DRAM's advantages from a commodity memory into a SoC. In the past decade, a lot research effort has been put into the embedded-DRAM (eDRAM) technologies, such as deep-trench capacitor with bottle etch [2], planar capacitor [3], [4], shallow trench capacitor [4], and metal-insulator-metal (MIM) capacitor [3], [5], to reduce the process adders to the CMOS process, where the eDRAM is embedded in. The eDRAM technologies are now available in the IC-foundry industry [6], [7] and its applications include the products of networking, multimedia handheld devices, gaming consoles, high definition television, and so forth.…”
Section: Introductionmentioning
confidence: 99%
“…Supply generation for embedded DRAM (eDRAM) in server class applications entails special challenges due to the stringent power, frequency, cell retention, variability, and distribution requirements [1,2]. Switched capacitor charge pumps have been traditionally used [3] in DRAM applications.…”
Section: Introductionmentioning
confidence: 99%