A MEMS 2-D Scanner with Bonded Single-Crystalline Honeycomb Micromirror

Patterson, P.A.; Toshiyoshi, Hiroshi; Wu, M.C.

doi:10.31438/trf.hh2000a.9

Cited by 11 publications

(4 citation statements)

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“…The discrepancy can be ascribed to the existence of the wing structure supporting the movable comb electrodes and the planar geometry of the reflective surface. Honeycomb structures are added to the frame to further reduce the mass while maintaining the rigidity of the mirror [15].…”

Section: Designmentioning

confidence: 99%

“…As shown in figure 4, the fabrication process is a simple sequence of silicon deep etch processes on both sides of the substrate, without any structural material deposition or substrate bonding processes, such as anodic, flip-chip and fusion bonding [12][13][14][15]17]. The movable part, composed of the mirror plate and reinforcement frame, torsion beam and movable comb, is defined simultaneously during the two-step etch process with the 120 µm thick device layer of the SOI wafer.…”

Section: Fabricationmentioning

confidence: 99%

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An electrostatic scanning micromirror with diaphragm mirror plate and diamond-shaped reinforcement frame

Choi

Kim

et al. 2006

J. Micromech. Microeng.

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We present the design, fabrication and measurement results of a comb-driven electrostatic scanning micromirror. Instead of a conventional micromirror having uniform thickness across the entire reflective surface, a diaphragm mirror plate supported by an array of diamond-shaped frame structures is fabricated monolithically. The fabrication process is a simple sequence of silicon deep etch processes on both sides of the silicon-on-insulator (SOI) substrate without the substrate bonding process. The micromirror is fabricated on the device layer of the substrate. The mirror plate undergoes a rotational motion by an electrostatic force between the movable comb electrodes connected to the micromirror and stationary comb electrode formed on the handle wafer. A scanning micromirror with a 10 µm thick diaphragm mirror plate, having a planar dimension of 1.5 × 1.5 mm 2 , supported by an array of 110 µm thick rhombic support frames, was fabricated and tested. A mechanical deflection angle of 8.5 • at a resonance frequency of 19.55 kHz and a pressure of 7 mTorr was obtained. A prototype of the raster scanning laser projection display system was developed using the fabricated micromirror as the horizontal scanner and a galvanomirror as the vertical scanner, respectively.

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Section: Designmentioning

confidence: 99%

Section: Fabricationmentioning

confidence: 99%

An electrostatic scanning micromirror with diaphragm mirror plate and diamond-shaped reinforcement frame

Choi

Kim

et al. 2006

J. Micromech. Microeng.

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“…The most common method of implementing two-axis (two degrees of freedom, 2DoF) rotation has been through the use of a gimbaled structure [5], [6], [7], although packaging-based methods with one-axis scanners are utilized as well. However, to implement 2DoF gimbaled micromirror without cross-talk between driving voltages, electrical isolation of the mechanical coupling linkages is required.…”

Section: B Two-axis Scanners and The Gimbal-less Approachmentioning

confidence: 99%

“…The actuators must be completely covered beneath the micromirror's reflecting plate for high fill-factor, therefore additional fabrication/packaging solutions are required. Some examples of previous work are given in [1], [5], [10]- [12]. We currently address this issue by separately fabricating low-inertia silicon micromirrors and transferring/bonding them into place on top of the provided actuators stages.…”

Section: Implications To Tip-tilt-piston Array Elementsmentioning

confidence: 99%

Tip-Tilt-Piston Actuators for High Fill-Factor Micromirror Arrays

Milanović¹,

Matus²,

McCormick³

2004

2004 Solid-State, Actuators, and Microsystems Workshop Technical Digest

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Tip-tilt-piston actuators for optical phased arrays with large deflection angle, large piston range, and fast update rates are demonstrated. The devices include bonded low-inertia micromirrors on top of actuators aimed to achieve >96% fillfactor arrays. The gimbal-less design methodology enables scaling devices down to a few 100 µm to allow future implementation of large arrays with <100 µsec update. Several different design architectures have been successfully fabricated and tested as individual devices, and as a 2x2 element array. Devices with square layouts are demonstrated with 800 µm down to 400 µm on a side. In each case the devices consist of 4 vertical combdrive rotators connected by 2 degree-of-freedom (DoF) linkages to a central stage. Each actuator can rotate bidirectionally to raise or lower its linkage, giving the stage the required 3 DoF. The stage is used as a platform for bonding of a thin, low-inertia mirror plate which then completely covers the actuator. A representative high field-factor actuator of 500 µm x 500 µm dimensions achieves optical deflection angles beyond -20° to 20° for both axes and greater than -12 µm to 12 µm pistoning, at <80V actuation. In comparison, a larger low field-factor device with a 600 µm diameter integrated micromirror is also demonstrated which utilizes 3 bi-directional actuators radially offset by 120° to achieve tip-tilt-piston actuation with -10° to 10° deflection in all axes and -30 µm to 30 µm pistoning.

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A MEMS Non-interferometric Differential Confocal Scanning Optical Microscope

Piyawattanametha

Patterson

et al. 2001

Transducers ’01 Eurosensors XV

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A MEMS 2-D Scanner with Bonded Single-Crystalline Honeycomb Micromirror

Cited by 11 publications

References 0 publications

An electrostatic scanning micromirror with diaphragm mirror plate and diamond-shaped reinforcement frame

An electrostatic scanning micromirror with diaphragm mirror plate and diamond-shaped reinforcement frame

Tip-Tilt-Piston Actuators for High Fill-Factor Micromirror Arrays

A MEMS Non-interferometric Differential Confocal Scanning Optical Microscope

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