The silicon etching that occurs during the CVD diamond
growth has been investigated as a function of the
methane content in the gas phase by SEM and AFM in the tapping mode on
pristine Si(111) surfaces. Size,
depth, and angular distributions of the etch pits were recorded.
We evidence the strong effect of the carbon
content on the etching process. The silicon etching is slightly
increased with addition of 0.1−0.25% of
methane in the feed gas, and depletes with larger addition of carbon.
This etching occurs easily along Si(100) directions. This is explained by the better stability on
(100) planes of the precursor SiH2 to remove
silane than on (111) planes. A modelization of the process points
out the balance between the drop of the
atomic hydrogen concentration in the gas phase and the inhibition of
hydrogen bulk diffusion into silicon
when increasing the methane content and covering the surface with
carbon. This explains the occurrence of
a maximum of silicon etching. Possible consequences on the diamond
nucleation process are then put forward.
It is thus expected that the etching of the silicon is generally
detrimental as generating low-density silicon
surface such as Si(100) where diamond nucleation is
inhibited.