2001
DOI: 10.1016/s0038-1101(01)00149-6
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A new IGBT behavioral model

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Cited by 31 publications
(12 citation statements)
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“…C ge is the gate emitter capacitance, and I g is the gate current. I n2 , I disp and I cg are used in (7) and (8) to establish the boundary condition for ADE. To calculate these currents, the MOS voltage…”
Section: Mos-side Modelingmentioning
confidence: 99%
“…C ge is the gate emitter capacitance, and I g is the gate current. I n2 , I disp and I cg are used in (7) and (8) to establish the boundary condition for ADE. To calculate these currents, the MOS voltage…”
Section: Mos-side Modelingmentioning
confidence: 99%
“…It provides us with information that can be used for the analysis of the device long-term reliability, maximum ratings characterization, package design optimization, correct choice of heatsink [9]. So through self-heating effect, there is a connection between the electrical and thermal performances of the semiconductor device as shown in Figure 1 [10]. The voltage across the device U CE and the current through the device I E will determine the power dissipated.…”
Section: Self-heating In Igbt Transistormentioning
confidence: 99%
“…In literature, the IGBT model has been represented by a couple of a simplified equivalent circuit. The first presents the IGBT as a N-channel MOSFET driving a PNP bipolar transistor in a Darlington configuration [4]- [8] , whereas the second consists of an N channel MOSFET in series with a diode [9]. The proposed models cannot describe the IGBT behaviour accurately, because the wide base in the IGBT differs from the existing discrete power BJT model.…”
Section: Introductionmentioning
confidence: 99%