2006
DOI: 10.1016/j.mee.2006.01.069
|View full text |Cite
|
Sign up to set email alerts
|

Assembly of an aperture plate system for projection mask-less lithography

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2006
2006
2022
2022

Publication Types

Select...
4

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(3 citation statements)
references
References 0 publications
0
3
0
Order By: Relevance
“…Special assembly equipment to align within about 200 nm is necessary [31]. Combining MEMS parts with CMOS electronics poses its own challenges: the CMOS must be produced first because foundries can only work on virgin wafers.…”
Section: Typical Mems Challenges For Masklessmentioning
confidence: 99%
“…Special assembly equipment to align within about 200 nm is necessary [31]. Combining MEMS parts with CMOS electronics poses its own challenges: the CMOS must be produced first because foundries can only work on virgin wafers.…”
Section: Typical Mems Challenges For Masklessmentioning
confidence: 99%
“…Mapper develops a low energy electron optic column (5 kV), Leica develops a high energy electron optic column (100 kV) [3,4]. The projects are at the end of the first phase and it is expected that a proof of concept will be demonstrated by the end of 2005.…”
Section: Maskless Approachesmentioning
confidence: 99%
“…Kruit 14) utilized a special assembly equipment. 15) The resulting misalignment was within about 200 nm. The misalignment can lead to change of micro-column performance 7,8,13) such as additional aberration and increase of minimum beam spot size.…”
Section: Introductionmentioning
confidence: 95%