“…Ferroelectric random access memories (FeRAM) have been attracting attention because of nonvolatile, low-power consumption, and high-speed operation. [1][2][3][4] In the last several years, in order to obtain the further performance (such as high-temperature operation) of FeRAM device applications, ferroelectrics have been integrated with the wide-gap semiconductors, such as SiC, GaN, and diamond, and their structural and electrical properties were reported. [5][6][7][8][9][10] However, in most cases, Pb(Zr,Ti)O 3 (Curie temperature T c : $360 C) was used as a ferroelectric material in the integrated structure.…”