Design of Fault-Tolerant Chip Interfaces

The article discusses the advantages of the «System on a Chip» design technology used to create ECB in Russia. The measures of structuring the program for the development of domestic SOC technology are proposed. Attention is paid to the direction of Fabless – Foundry (Design – Production). The processes of interaction between designers, manufacturers and consumers from different sides are described.

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Systems on a Chip (Soc) and the Impact of This Technology on the Creation of a Modern Ecb

Zolnikov

Евдокимова

Arzamascev³

et al. 2021

Modeling of Systems and Processes

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Classification of the effects of AI CP on REE

Kozyukov¹,

Chubunov²,

Zolnikov³

et al. 2021

Modeling of Systems and Processes

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During the flight, charged particles of outer space act on space systems (orbital stations, spacecraft, interplanetary spacecraft, etc.), which, without the use of special protection measures, can lead to the failure of onboard systems. They are particularly dangerous for systems that use electronic components (semiconductor devices and integrated circuits, optoelectronic devices). These systems in the spacecraft, as a rule, include all control systems, telemetry systems, receiving and transmitting devices, thermal control systems, power supply systems, etc., which in general can be called radio-electronic equipment (REE).

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Implementation of the optimal construction of a combination device and evaluation of reliability by output voltage

Makarenko

Yagodkin

Zolnikov³

et al. 2022

Modeling of Systems and Processes

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The theoretical propositions of the algebra of logic are considered. It is noted that the current microcircuitry based on the algebra of logic contains logical statements: true (yes) is a logical unit, false (no) is a logical zero. Based on the given logical function: ((ABC)×D + A×(BCD) + A×(BC)×D + (AB)×(CD), frontal, minimal, transformed minimal variants of the combination device are implemented, as well as minimized variants in the bases "AND-NOT" and "OR-NOT". A combination device based on import-substituting chips of 155, 176 series has been designed. The analysis of the obtained devices is made from the standpoint of technical and economic indicators, in particular, an assessment of the number of logic elements used, an assessment of the symmetry of the structure, as a result, a reduction in energy consumption, an increase in performance, improvements in parameters for reliability of functioning, a decrease in weight and size characteristics. Assuming that the law of change of the information parameter U1 is close to linear, taking into account the effect of temperature as boundary values for the elements of the applied microcircuits, taking the values -60 °C and +120°. Accordingly, the parametric reliability of the optimal implementation of the device according to the output voltage parameter is calculated. The conclusion is made about the inverse dependence of parametric reliability on temperature growth. A recommendation is given when evaluating parametric reliability for a number of other information parameters about the need to take into account both the number of chips used and the type of their interconnections.

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Design of Fault-Tolerant Chip Interfaces

Cited by 9 publications

References 4 publications

Systems on a Chip (Soc) and the Impact of This Technology on the Creation of a Modern Ecb

Systems on a Chip (Soc) and the Impact of This Technology on the Creation of a Modern Ecb

Classification of the effects of AI CP on REE

Implementation of the optimal construction of a combination device and evaluation of reliability by output voltage

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