Design process supporting simulations on wafer level packages

Sommer, J.-P.; Wittler, Olaf; Manessis, D.; Michel, B.

doi:10.1109/dtip.2003.1287006

Cited by 3 publications

(5 citation statements)

References 2 publications

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“…First, a generalised plane-strain model in a parallel cross section was created for a diminished computational effort. The results have already been reported (Sommer et al 2003). It could be shown that the computed maximum stresses remain lower than the ultimate strength values for the corresponding materials and the interfaces between them at each step This is in agreement with the manufacturer's experience.…”

Section: Fe-sequential Build-upsupporting

confidence: 91%

“…As shown in the study (Sommer et al 2003) on sequential build-up, large straining of the copper occurs at the micro-via corner. During lifetime it may be expected that thermal strains of the polymer layers lead to fatigue of the copper layer.…”

Section: Parametric Thermo-mechanical Studymentioning

confidence: 92%

“…The FE analysis has gained importance also in design support for electronic components (Sommer et al 2000a(Sommer et al , 2000b(Sommer et al , 2002(Sommer et al , 2003Sommer 2004). Based on a complete description of geometry, loading, and material parameters, displacement fields (in thermo-mechanical cases) and temperature (in thermal cases) are calculated primarily which are the basis for derived quantities (strains and stresses, or heat fluxes, respectively) and the comparison with ultimate strength parameters for materials and interfaces.…”

Section: Fe-methodologymentioning

confidence: 98%

“…As the properties differ strongly from the properties of bulk materials, special methods exist for characterising these films (Brotzen 1994). For the current task, tensile tests of free standing films were preferred, as best as it was possible to handle these specimens (Sommer et al 2003). This approach becomes problematic for the thin and brittle films in the packages of interest like BCB or other dielectrics.…”

Section: Determination Of Materials Propertiesmentioning

confidence: 99%

“…After analysis of sequential build-up and investigation of the general thermal behaviour of the PT (Sommer et al 2003), the micro-via connecting all contacts to one side becomes the focus of the investigation. As shown in the study (Sommer et al 2003) on sequential build-up, large straining of the copper occurs at the micro-via corner.…”

Section: Parametric Thermo-mechanical Studymentioning

confidence: 99%

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Thermo-mechanical analysis of advanced electronic packages in early system design

et al. 2005

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The thermal and thermo-mechanical behaviour of advanced electronic packages should be taken into account from the initial design phase in order to achieve a high level of reliability. Numerical studies by means of finite element (FE) analyses are very useful in order to reveal and evaluate the essential thermal and mechanical influences which are induced during manufacturing, storing, transport, and operation. Two different types of packages are under investigation, an RF-system on chip including digital and analogue parts on one chip (RF SoC), and combined in a BGA-type package, made by Shellcase Ltd, and a power transistor with all contacts on one side. Parametric FE analyses are presented in order to pre-optimise the shape of the interconnects and to improve the compliance between stiff components before prototyping and real testing

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Section: Fe-sequential Build-upsupporting

confidence: 91%

Section: Parametric Thermo-mechanical Studymentioning

confidence: 92%

Section: Fe-methodologymentioning

confidence: 98%

Section: Determination Of Materials Propertiesmentioning

confidence: 99%

Section: Parametric Thermo-mechanical Studymentioning

confidence: 99%

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Thermo-mechanical analysis of advanced electronic packages in early system design

et al. 2005

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Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Sommer

Michel

Ostmann

2006

2006 1st Electronic Systemintegration Technology Conference

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In order to achieve highfunctionality and reliability and to minimise the number oflater redesign loops, thermal and thermo-mechanical reliability aspects should be taken into account alreadyfrom the beginning ofthe initial design phase ofnew products orfo rdeveloping ofa new technology. For this purpose, numerical studies by means offinite element (FE) analyses are very efficient to check the desiredproperties.Within the research project "Hiding Dies ", funded by the European Commission, several packages with hidden dies are under construction. A special test board with different thermal test chips (TTCs) was designed regardingpredicted thermal as well as thermo-mechanicalproperties. The authors outline their experience in supporting the design process ofpackages with buried dies. It proved to be important to combine technological knowledge, experience in FEA, and a sufficiently quick response time. IntroductionInnovative electronic portable products can be characterised by increasing signal frequencies and the demand on higher density of functions, which requires more space, for active components as well as for passives. One way to meet these requirements is a three-dimensional integration of components. The authors follow a so-called "chip in polymer" approach, introduced by Fraunhofer IZM and TU Berlin [1]. It allows an extremely dense integration and very short interconnects, necessary for applications in the GHz-range. Thinned Si-components are embedded directly into the printed circuit boards, and the interconnects are realised by laser drilling and galvanic metallisation.The basic interconnect structure, which is neither a flip chip nor a wirebond, is shown in Fig. 1.

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Numerical Characterisation of Electronic Packaging Solutions based on Hidden Dies

Sommer

Michel

Ostmann

2005 6th International Conference on Electronic Packaging Technology

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Design process supporting simulations on wafer level packages

Cited by 3 publications

References 2 publications

Thermo-mechanical analysis of advanced electronic packages in early system design

Thermo-mechanical analysis of advanced electronic packages in early system design

Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Numerical Characterisation of Electronic Packaging Solutions based on Hidden Dies

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