Numerical Characterisation of Electronic Packaging Solutions based on Hidden Dies

In order to achieve highfunctionality and reliability and to minimise the number oflater redesign loops, thermal and thermo-mechanical reliability aspects should be taken into account alreadyfrom the beginning ofthe initial design phase ofnew products orfo rdeveloping ofa new technology. For this purpose, numerical studies by means offinite element (FE) analyses are very efficient to check the desiredproperties.Within the research project "Hiding Dies ", funded by the European Commission, several packages with hidden dies are under construction. A special test board with different thermal test chips (TTCs) was designed regardingpredicted thermal as well as thermo-mechanicalproperties. The authors outline their experience in supporting the design process ofpackages with buried dies. It proved to be important to combine technological knowledge, experience in FEA, and a sufficiently quick response time. IntroductionInnovative electronic portable products can be characterised by increasing signal frequencies and the demand on higher density of functions, which requires more space, for active components as well as for passives. One way to meet these requirements is a three-dimensional integration of components. The authors follow a so-called "chip in polymer" approach, introduced by Fraunhofer IZM and TU Berlin [1]. It allows an extremely dense integration and very short interconnects, necessary for applications in the GHz-range. Thinned Si-components are embedded directly into the printed circuit boards, and the interconnects are realised by laser drilling and galvanic metallisation.The basic interconnect structure, which is neither a flip chip nor a wirebond, is shown in Fig. 1.

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“…The FE analysis has gained importance also in design support for electronic components [4][5][6][7][8].…”

Section: Finite Element Analysis and Designmentioning

confidence: 99%

Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Sommer

Michel

Ostmann

2006

2006 1st Electronic Systemintegration Technology Conference

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Embedding technologies for an automotive radar system

Becker

Koch

Kahle

et al. 2009

2009 59th Electronic Components and Technology Conference

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Radar sensors are already employed in production model vehicles e.g. for adaptive cruise control (ACC) systems. Further development of driver assistance systems has also led to the use of radar sensors in active safety systems (active brake assistance, collision warning, emergency braking, etc). However, the costs of manufacturing such radar-based systems, capable of gathering reliable information from surroundings, for vehicles across the market spectrum or for compact executive cars are still too high. Thus, despite the improved reliability characteristics, detection properties and safety required for these sensors, the aim is to manufacture such systems more cost-effectively. The German national "KRAFAS (Cost-optimized Radar Sensor for Active Driver Assistance Systems)" project is aiming at integrating 77 GHz components (esp. SiGe MMICs) into a printed circuit board, combining driver and 77 GHz RF circuitry and integrating antenna elements. This will significantly reduce current costs of the 77 GHz RF module by 20-30%. A sketch of such a module with an adapted cylindrical radar lens is depicted in Figure 1. [GRAPHICS] In this paper, design, simulation, technological development, demonstrator realization and subsequent measurement of interconnects of embedded active 77 GHz chips to a high frequency substrate using microvia technology is described. The used molded embedding technology offers great opportunities for a very broad range of frequencies and applications as well as large potential for cost reduction

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Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements

Sommer

Michel

Noack

et al. 2008

2008 2nd Electronics Systemintegration Technology Conference

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More and more dense packaging is one of the most important challenges in advanced electronics and micro technology, driven by requirements like low cost and high reliability. One way to meet these demands is to follow the so-called ldquochip in duromerrdquo approach, which allows an extremely dense integration and very short interconnects. Already in the very first design phase of advanced products, numerical studies by means of finite element analyses (FEA) are very efficient to check the desired properties regarding functionality as well as reliability aspects. This has been carried out with a new generation of active distance control (ADC) devices for automobiles, based on a radar principle. In order to obtain sufficiently flat modules for subsequent manufacturing steps, thermally induced deformations were measured at suitable specimens by means of the microDAC technique, developed by CWM GmbH Chemnitz and Fraunhofer IZM. Combining FE analyses and measured deformations, a methodology was developed which can be generalised and applied to many design procedures before any real parts are available. It is helpful to reduce cost and time-to-market for future products by minimising real tests and an expensive redesign

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Numerical Characterisation of Electronic Packaging Solutions based on Hidden Dies

Cited by 4 publications

References 3 publications

Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Embedding technologies for an automotive radar system

Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements

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