Embedded Wafer Level Ball Grid Array (eWLB)

Brunnbauer, Markus; Meyer, Tyler; Ofner, G.; Mueller, Kurt; Hagen, Ronald

doi:10.1109/iemt.2008.5507866

Cited by 122 publications

(30 citation statements)

References 1 publication

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“…M.Brunnbauuer introduced wafer level package technology, which includes chip relocation, fixture at a new location and encapsulation [8]. One of the key process steps is encapsulating the relocated chips with molding compound.…”

Section: Wafer Level Molding With Fammentioning

confidence: 99%

Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs

Hamelink

2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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To meet the needs of ambient intelligence and the miniaturization of electronics, a MEMS/sensor package with exposed windows needs access to the environment. This presents a challenge for MEMS or sensor packaging/encapsulation. The exposed die and MEMS/sensor are brittle and can not withstand large stresses. By clamping a film around the chip's functional area, the surface of the chip is protected by film and the MEMS/sensors exposed window will be bleed and flash free. Relative to steel clamping force, the clamping force when using soft film is dramatically decreased. Film Assisted Molding (FAM) technology can meet the packaging demands of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the advanced MEMS microsystems with low cost and excellent performance. Tiny exposed windows can be directly realized in the mold cap with film assisted transfer molding technology. This technology can be adopted to thru-mold vias for Package on Package (PoP) applications. Film assisted technology also opens the opportunity of wafer level transfer molding with an exposed window.The increasing demand for light emitting diodes (LEDs) has been driven by many applications, including communications, signage and large power solid state lighting (SSL). The LED encapsulation can be implemented by film assisted molding technology in die, package and module level. High power Solid state lighting (SSL) is a new promising lighting technology based the brightness light emetting diode (LED), which is promising to replace the conventional light sources for its economic and environmental saving. The encapsulation of SSL at die and module level is a challenge with low costs and high efficiency thermal management.

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Section: Wafer Level Molding With Fammentioning

confidence: 99%

Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs

Hamelink

2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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“…In the standard antenna concept in eWLB with single-layer RDL, the top layer of PCB is used as a reflector. [1,2,3,4,5] A. Package size Size of the package is an important parameter to design an antenna in package.…”

Section: Antenna Package Interaction In Ewlbmentioning

confidence: 99%

The impact of embedded wafer level BGA package on the antenna performance

PourMousavi

Wojnowski

Agethen

et al. 2013

2013 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC)

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In this article, we present a study about the impact of embedded wafer level ball grid array (eWLB) on characteristics of antenna. The antenna in package is a promising solution for integration of antennas and eWLB technology enables integration of passive components and antennas into the redistribution layer (RDL). The antenna radiates perpendicular to the package in broadside into the package. There are different parameters such as size, shape, and thickness of the eWLB package which affect the radiation pattern significantly. Moreover, the materials properties of r impact the impedance bandwidth, gain and efficiency of antenna and have to be taken into account. The other important parameter to design the antenna in package is the distance of antenna to the reflector. We present the feasibility of an antenna with backside metallization as an integrated reflector in an 8 mm x 8 mm eWLB package. The measurement and simulation results show that eWLB is an attractive candidate for mm-wave applications.Index Terms -eWLB package, system-in-package, integrated antenna, antenna in package, millimeter wave radar.

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“…Recently, a foil-based chip embedding technology was jointly developed by Holst Centre and imec [2], [3]. In contrast to fan-out WLP [4] and chip embedding in rigid or flexible printed circuit boards [5], [6], where cost reduction is achieved by scaling to larger panel sizes, low-cost was a main development goal of this chip embedding technology. The roll-to-roll compatible process flow starts by placing naked dies and thin passive components on a bare copper foil using anisotropic and isotropic conductive adhesive, respectively.…”

Section: Introductionmentioning

confidence: 99%

Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

Cauwe

Vandecasteele

Baets

et al. 2013

International Symposium on Microelectronics

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The technology development for a low-cost, roll-to-roll compatible chip embedding process is described in this paper. Target applications are intelligent labels and disposable sensor patches. Two generations of the technology are depicted. In the first version of the embedding technology, the chips are embedded in an adhesive layer between a copper foil and a PET film. While this results in a very thin (< 200 µm) and flexible system, the single-layer routing and the incompatibility with passive components restricts the application of this first generation. The double-sided circuitry embedding technology is an extension of the single-sided, foil-based chip embedding, where the PET film is replaced by a second metal foil. To obtain sufficient mechanical strength and to further reduce cost, the adhesive film is replaced by a substrate material which is compatible with the chip embedding concept. Both versions of the foil-based embedding technology are very versatile, as they are compatible with a broad range of polymer materials, for which the specifications can be tuned to the final application.

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Embedded Wafer Level Ball Grid Array (eWLB)

Cited by 122 publications

References 1 publication

Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs

Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs

The impact of embedded wafer level BGA package on the antenna performance

Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

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